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Nylon copper plating film and preparation method thereof

A nylon film, nylon technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems affecting the large-scale production of nylon copper plating process, restricting the development of nylon copper plating shielding materials, and incomplete coverage of metal film. and other problems, to achieve the effect of low cost, low price, human body and environmental friendliness

Active Publication Date: 2018-07-24
杭州金杭包装印业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, the metal shielding film on the surface of the nylon film is often incompletely covered by the metal film, and the coating film is uneven, resulting in poor shielding effect, and even due to the poor bonding force between the nylon material and the metal film interface, the coating film is prone to drop during use. This phenomenon seriously affects the large-scale production of nylon copper plating process and limits the development of nylon copper plating shielding materials.

Method used

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  • Nylon copper plating film and preparation method thereof
  • Nylon copper plating film and preparation method thereof
  • Nylon copper plating film and preparation method thereof

Examples

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Embodiment 1

[0043] The present embodiment provides a nylon copper-plated film and a preparation method thereof, comprising the following steps:

[0044] S1. Surface treatment of nylon membrane: grind the nylon membrane in the same direction with a metallographic sample pre-grinder, and then dip it in sodium hydroxide solution;

[0045] Among them, the speed of the metallographic sample pre-grinding machine is 100r / min, the grinding time is 30s, and the specification of the sandpaper used is 800 mesh. The concentration of sodium hydroxide solution is 100g / L, the temperature is 50°C, and the soaking time is 20min.

[0046] S2. Activation and catalysis of the nylon membrane: the nylon membrane of step S1 is activated and catalyzed in silver ammonia solution and sodium hypophosphite solution respectively;

[0047] Wherein, silver ammonia solution is configured with silver nitrate, ammonia water, deionized water, and silver nitrate concentration is 2g / L, and ammonia water concentration is 5mL...

Embodiment 2

[0053] The preparation steps of this embodiment and embodiment 1 are basically the same, the difference is:

[0054] In step S1, the speed of the metallographic sample pre-grinder is 200r / min, the grinding time is 10s, and the specification of the sandpaper used is 2000 mesh. The concentration of sodium hydroxide solution is 75g / L, the immersion temperature is 65°C, and the immersion time is 30min.

[0055] In step S2, the concentration of silver nitrate is 6g / L, the concentration of ammonia water is 15mL / L; the concentration of sodium hypophosphite solution is 40g / L. The activation temperature is 25° C., and the time is 30 minutes; the catalytic temperature is 40° C., and the time is 15 minutes.

[0056] In step S3, the concentration of copper sulfate in the plating solution is 50g / L, the concentration of ethylenediaminetetraacetic acid is 90g / L, the concentration of sodium hydroxide is 15g / L, and the temperature of deionized water for configuring the solution is 40°C; the r...

Embodiment 3

[0059] The preparation steps of this embodiment and embodiment 1 are basically the same, the difference is:

[0060] In step S1, the speed of the metallographic sample pre-grinder is 150r / min, the grinding time is 20s, and the specification of the sandpaper used is 1500 mesh. The concentration of sodium hydroxide solution is 50g / L, the immersion temperature is 80°C, and the immersion time is 10min.

[0061] In step S2, the concentration of silver nitrate is 4g / L, the concentration of ammonia water is 10mL / L; the concentration of sodium hypophosphite solution is 30g / L. The activation temperature is 40° C. and the time is 20 minutes; the catalytic temperature is 30° C. and the time is 20 minutes.

[0062] In step S3, the concentration of copper sulfate in the plating solution is 30g / L, the concentration of ethylenediaminetetraacetic acid is 60g / L, the concentration of sodium hydroxide is 12g / L, and the temperature of deionized water for configuring the solution is 50°C; the red...

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Abstract

The invention discloses a nylon copper plating film and a preparation method thereof. The preparation method comprises the steps of carrying out surface treatment on a nylon film, sensitizing and catalyzing the nylon film, preparing a plating solution and a reducing solution, and preparing the nylon copper plating film. The preparation method comprises the concrete steps of using sand paper and asodium hydroxide solution for carrying out surface treatment on the nylon film, then activating and catalyzing in a silver-ammonia solution and a sodium hypophosphite solution, and finally carrying out copper plating on the nylon film in a plating solution so as to obtain the nylon copper plating film. The method provided by the invention is simple, safe, green and environmentally friendly in process without the need for complicated equipment, and lower in cost; the produced nylon copper plating film finished product is higher in yield, complete in plating layer covering, and controllable in thickness, has a wide application prospect and is suitable for industrial application.

Description

technical field [0001] The invention relates to an electromagnetic shielding material, in particular to a nylon copper-plated film and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, more and more electronic products and equipment are used in people's production and life, electromagnetic radiation has become an important issue affecting people's life and health and the stability of electronic equipment, and various countries and regions have strict regulations on electromagnetic shielding. Standard requirements are also getting stricter. Although the penetration ability of electromagnetic wave propagation is extremely strong, excellent conductive or magnetically permeable materials can be used to shield electromagnetic wave radiation. Conductive fabrics covered with metals such as copper, silver or nickel, such as thin films, are important materials for preventing electromagnetic interference. They can be proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/30C23C18/20C23C18/16
CPCC23C18/1633C23C18/2013C23C18/30C23C18/40
Inventor 孙翱魁陈晴柔刘跃军夏勇赖登旺
Owner 杭州金杭包装印业有限公司
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