Mushroom culture medium and preparation method thereof
A technology for cultivating substrate and shiitake mushrooms, which is applied in the directions of botanical equipment and methods, preparation of organic fertilizers, calcareous fertilizers, etc., can solve the problem of large price increase of cottonseed hulls, high cost of edible mushroom cultivation, unstable edible mushroom yield, etc. problems, to achieve the effect of improving water retention and air permeability, saving non-renewable resources, and automatically adjusting pH in a small range
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0036] A kind of Lentinus edodes cultivation substrate of the present embodiment comprises the following raw materials by weight:
[0037] 8 parts of ore powder, 20 parts of agricultural slag, 15 parts of sawdust, 1 part of quicklime, 6 parts of compound cake fertilizer, 2 parts of nutrient element additives, 5 parts of cottonseed husks, 4 parts of wheat bran, 4 parts of insect-inhibiting and enhancing additives parts, 10 parts of water, 7 parts of humus, 3 parts of pond mud, 4 parts of agricultural straw, and 3 parts of industrial flour.
[0038] The ore powder in this embodiment is a mixed powder of potassium feldspar, perlite and kaolinite crushed to 150 meshes in a weight ratio of 3:3:1.
[0039] The agricultural residue in this embodiment is a mixture of bagasse, distiller's grains, and furfural residue in a weight ratio of 2:1:3.
[0040] The compound cake fertilizer in this embodiment is a mixture of rapeseed cake, bean cake, peanut cake and sesame cake in a weight rat...
Embodiment 2
[0050] A kind of Lentinus edodes cultivation substrate of the present embodiment comprises the following raw materials by weight:
[0051] 12 parts of ore powder, 30 parts of agricultural slag, 25 parts of sawdust, 3 parts of quicklime, 10 parts of compound cake fertilizer, 3 parts of nutritional element additives, 7 parts of cottonseed husks, 6 parts of wheat bran, 6 parts of insect-inhibiting and enhancing additives parts, 16 parts of water, 9 parts of humus, 5 parts of pond mud, 6 parts of agricultural straw, and 5 parts of industrial flour.
[0052] The ore powder in this embodiment is a mixed powder of potassium feldspar, perlite and kaolinite crushed to 150 meshes in a weight ratio of 3:3:1.
[0053] The agricultural residue in this embodiment is a mixture of bagasse, distiller's grains, and furfural residue in a weight ratio of 2:1:3.
[0054] The compound cake fertilizer in this embodiment is a mixture of rapeseed cake, bean cake, peanut cake and sesame cake in a weig...
Embodiment 3
[0064] A kind of Lentinus edodes cultivation substrate of the present embodiment comprises the following raw materials by weight:
[0065] 10 parts of ore powder, 25 parts of agricultural slag, 20 parts of sawdust, 2 parts of quicklime, 8 parts of compound cake fertilizer, 2.5 parts of nutritional element additives, 6 parts of cottonseed husks, 5 parts of wheat bran, and 5 parts of insect-inhibiting and enhancing additives. parts, 13 parts of water, 8 parts of humus, 4 parts of pond mud, 5 parts of agricultural straw, and 4 parts of industrial flour.
[0066] The ore powder in this embodiment is a mixed powder of potassium feldspar, perlite and kaolinite crushed to 150 meshes in a weight ratio of 3:3:1.
[0067] The agricultural residue in this embodiment is a mixture of bagasse, distiller's grains, and furfural residue in a weight ratio of 2:1:3.
[0068] The compound cake fertilizer in this embodiment is a mixture of rapeseed cake, bean cake, peanut cake and sesame cake in ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com