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Resin based diamond dicing blade for LED segmentation and preparation method thereof

A diamond and fund technology, which is applied in the field of resin-based diamond dicing blades for LED segmentation and its preparation, can solve the problem that chip sides are prone to chipping, chipping and cracks, high machine cost and labor cost, personnel and machine cost. To solve the problem of large demand for the table, to achieve the effect of increasing self-sharpening ability, good cutting quality and stability, improving work efficiency and processing cost

Active Publication Date: 2018-07-20
苏州赛尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current LED cutting speed is low, the cutting knife wears fast, the life is short, the diamond cutting knife is more expensive, and the demand for personnel and machines is relatively large, resulting in high machine costs and labor costs, and the cutting knife is directly in contact with the chip during cutting , the side of the chip is prone to edge chipping, chipping and cracks, and the product qualification rate is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] According to the volume ratio, accurately weigh 12.5% ​​diamond, 62% epoxy resin powder, 4.2% zinc oxide, 11.3% aluminum oxide, 9% carbon fiber, 1% 4-methylbenzyl alcohol, and put several raw materials into stainless steel jars , mixed at a speed of 100rpm / m on a planetary ball mill for 3 hours to form a molding material, put the molding material into the mold cavity, smooth it with a scraper, cover the mold, transfer the mold to the worktable of the hot press, and press 200KN , 150°C, hot-pressed under air conditions for 12 minutes, water-cooled mold and demolded to obtain a hot-pressed green body with a scribing knife, and then after a secondary curing of 150°C for 14 hours, it enters machining to grind the inner and outer diameters, the blade accuracy is 4 μm, and the cutting 2 *2mm LED, cutting speed 40mm / s, blade cutting life 8000m, processing yield over 98%.

Embodiment 2

[0035] According to the volume ratio, accurately weigh 18.75% diamond, 58% phenolic resin powder, 4.7% zinc oxide, 7.55% aluminum oxide, 10% carbon fiber raw material, 1% 4-methyl benzyl alcohol, and put several raw materials into stainless steel jars , mixed at a speed of 100rpm / m on a planetary ball mill for 3 hours to form a molding material, put the molding material into the mold cavity, smooth it with a scraper, cover the mold, transfer the mold to the worktable of the hot press, and press 250KN , 150°C temperature, hot pressing under air conditions for 12min, water cooling mold and demoulding to obtain the scribing knife body, and then after 150°C curing for 14h after secondary curing, it enters into machining to grind the inner and outer diameters, the blade accuracy is 4μm, and the cutting is 1.9*2mm LED, the cutting speed is 40mm / s, the cutting life of the blade is more than 8000m, and the processing yield is over 98%.

Embodiment 3

[0037] According to the volume ratio, accurately weigh 19.5% diamond, 54.5% polyimide resin powder, 6.8% zinc oxide, 10% aluminum oxide, 9.2% carbon fiber, 1% 4-methyl benzyl alcohol raw materials, and put several raw materials into In a stainless steel jar, mix the materials on a planetary ball mill at a speed of 100rpm / m for 3 hours to form a molding material, put the molding material into the mold cavity, smooth it with a scraper, cover the mold, and transfer the mold to the workbench of the hot press machine. With 220KN pressure, 150°C temperature, hot pressing under air conditions for 12 minutes, water cooling mold and demoulding to obtain the scribing blade body, and then after 150°C curing for 14 hours after secondary curing, it enters into machining to grind the inner and outer diameters, the blade accuracy is 4 μm, and cuts 2.2*2.5mm LED, cutting speed 40mm / s, blade cutting life up to 8000m, processing yield over 98%.

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PUM

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Abstract

The invention discloses a resin based diamond dicing blade for LED segmentation and a preparation method thereof. The preparation method includes: subjecting a mixture of diamond, resin powder, zinc oxide, alumina, carbon fiber and 4-methylbenzyl alcohol to ball milling, and then performing hot-pressing to obtain a hot-pressed green body; conducting curing treatment on the hot-pressed green body at 130-160DEG C for 12-16h to obtain a molded body; and processing the molded body to obtain the resin based diamond dicing blade for LED segmentation. The product provided by the invention can meet LED precision machining process, the blade precision can reach 4microm, the cutting speed can be raised to 40mm / s, and the life span can reach 8000m, therefore the working efficiency and processing costare greatly improved.

Description

technical field [0001] The invention belongs to the technical field of cutting knives, and in particular relates to a resin-based diamond scribing knife for LED segmentation and a preparation method thereof. Background technique [0002] The consumption of semiconductor materials reflects the scale and process level of a country's IC manufacturing industry. With the development of LED chip technology and packaging technology, multi-chip LED components have gradually entered the market in response to the demand for high luminous flux LED products in the lighting field. The current LED cutting speed is low, the cutting knife wears fast, the life is short, the diamond cutting knife is more expensive, and the demand for personnel and machines is relatively large, resulting in high machine costs and labor costs, and the cutting knife is directly in contact with the chip during cutting , The side of the chip is prone to edge chipping, chipping and cracks, and the product qualific...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08L79/08C08K13/04C08K7/06C08K3/04C08K3/22C08K5/05
CPCC08K3/04C08K3/22C08K5/05C08K7/06C08K13/04C08K2003/2227C08K2003/2296C08L63/00C08L61/06C08L79/08
Inventor 王丽萍李威刘学民陈昱冉隆光
Owner 苏州赛尔科技有限公司
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