Nonuniform wet silicon-based micro-channel phase change heat exchanger with communicated top

Abstract

The invention discloses a nonuniform wet silicon-based micro-channel phase change heat exchanger with a communicated top, and belongs to the technical field of electronic cooling. Upper glass and bottom silicon are in anodic bonding to form the micro-channel phase change heat exchanger, a liquid inlet and a liquid outlet are formed in the upper glass, a liquid inlet tank, a liquid outlet tank andnucleated hole arrays are arranged on the front of the bottom silicon, the nucleated hole arrays are parallelly connected with micro-channels, the opened micro-channels are communicated at the top each other, hydrophilic silicon dioxide thin films are arranged on the side surfaces and the bottom surfaces of the micro-channels and the top surface of the rib wall between the micro-channels, the nucleated hole arrays are positioned at the bottoms of the micro-channels, hydrophobic silicon is arranged on the inner surfaces of the nucleated hole arrays, and an electric heating film is processed onthe back of the bottom silicon and used for simulating an external heat source. The phase change heat exchanger has the advantages that the heat exchanger has low starting temperature, a high heat exchange coefficient and critical heat flux density, high heat transfer stability and a wide application prospect.

Description

technical field [0001] The invention belongs to the technical field of electronic cooling, in particular to a non-uniform wettability silicon-based microchannel phase-change heat exchanger connected at the top. Background technique [0002] With the continuous development of microelectronics integration technology, the number of integrated transistors per unit area is increasing, resulting in a sharp increase in heat flux per unit area, and its heat dissipation and cooling problems have become one of the main bottlenecks restricting the development of microelectronic chips. . At present, mainstream chip cooling technologies include air cooling and liquid cooling technologies. For example, desktop computer CPUs are usually cooled by air cooling technology, and notebook computers are usually cooled by heat pipe-based cooling technology. Due to its large specific surface area and relatively high heat dissipation capacity, microchannel coolers show great application prospects i...

AI Technical Summary

Problems solved by technology

In addition, in phase change systems, especially in parallel microchannel heat exchangers, since the nucleation of bubbles between parallel microchannels is not synchronized, the nucleation and growth of bubbles will cause the pressure in the channel to fluctuate, and the pressure between different channels will be different. Poor, resulting in the instability of the parallel channel of the phase change system, which makes the flow and heat transfer characteristics of different channels fluctuate, resulting in local pulsating thermal stress, which easily leads to thermal fatigue damage of electronic chips

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