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A kind of preparation method of high thermal conductivity diamond/copper composite material

A composite material and diamond technology, which is applied in the field of composite material preparation, can solve the problems that diamond/copper composite materials cannot achieve near-net shape, high quality, and large-scale preparation of large-sized sheet samples, and achieves low pressure and stress. Uniform and high forming accuracy

Active Publication Date: 2019-12-10
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the existing diamond / copper composite material preparation method cannot realize the near-net shape, high quality, and large-scale preparation of large-scale thin sheet samples, and provides a high thermal conductivity diamond / copper-based composite material preparation method

Method used

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  • A kind of preparation method of high thermal conductivity diamond/copper composite material
  • A kind of preparation method of high thermal conductivity diamond/copper composite material
  • A kind of preparation method of high thermal conductivity diamond/copper composite material

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specific Embodiment approach 1

[0044] Specific embodiment one: the preparation method of the high thermal conductivity diamond / copper composite material of this embodiment is carried out according to the following steps:

[0045] Step 1: Weigh the raw diamond powder coated with a coating layer on the surface, put it into a molding mold and perform a vibration treatment to make a preform; place the preform in a crucible, and place the block pure copper or block copper alloy Place the crucible on the upper part of the prefabricated body in the crucible; or weigh the raw diamond powder and put it into the forming mold and perform vibration treatment to make the prefabricated body; place the prefabricated body in the crucible, and put the block The copper alloy is placed on the upper part of the preform in the crucible, and the crucible is placed in the air pressure infiltration furnace;

[0046] The material of the molding die is high-purity graphite or isostatic graphite;

[0047] The crucible is made of hig...

specific Embodiment approach 2

[0063] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the mass ratio of the block pure copper or block copper alloy described in step one and the diamond raw powder coated with the coating layer on the surface after the vibration treatment is: (0.85~2.07):1. Other steps and parameters are the same as those in the first embodiment.

[0064] Embodiment 3: The mass ratio of the massive copper alloy described in step 1 to the raw diamond powder after the vibration treatment is (0.85-2.07):1. Other steps and parameters are the same as those in Embodiment 1 or 2.

specific Embodiment approach 4

[0065] Embodiment 4: This embodiment differs from Embodiment 1 to Embodiment 3 in that: during the vibration treatment described in step 1, the forming mold is placed on an ultrasonic vibration plate, and vibrates for 5 to 15 minutes at a frequency of 20 to 30 kHz . Other steps and parameters are the same as those in the first to third specific embodiments.

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Abstract

The invention discloses a method for preparing a high thermal conductivity diamond / copper composite material, relating to a method for preparing the composite material. The purpose of the present invention is to solve the problem that the existing diamond-copper composite material preparation method cannot realize near-net shape, high-quality and large-scale preparation of large-size thin sheet samples. Preparation method: Put diamond powder into a mold and vibrate to make a preform, place the preform in a crucible, place pure copper or block copper alloy on the upper part of the preform, vacuumize, heat up and melt copper under the protection of an inert gas, Pressure impregnation, pressure holding and cooling, pressure relief, and finally demoulding. Beneficial effects: the method of the present invention can realize high-efficiency mass production, high mechanical properties, high yield, can prepare large-size thin slice samples, improve thermal conductivity of samples, low preparation cost, less impurity content, and both molding molds and crucibles can be used reuse. The invention is suitable for preparing high thermal conductivity diamond / copper composite material.

Description

technical field [0001] The invention relates to a preparation method of a composite material. Background technique [0002] With the continuous improvement of chip integration, electronic packaging is developing in the direction of miniaturization, light weight and high performance, which makes the operating temperature of the circuit continue to rise, and the heating rate per unit volume of the system continues to increase, resulting in unstable system operation. In order to obtain stable performance, heat dissipation conditions must be improved, so the importance of electronic packaging in the field of microelectronics is increasing, and the demand for new electronic packaging materials is also increasing. High-quality diamond is the material with the highest thermal conductivity known in the world, which can reach 1800-2000W / (m·K), and it is an insulator at room temperature. It also has the characteristics of low dielectric constant and low thermal expansion coefficient, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/10C22C9/00C22C26/00
CPCC22C1/1015C22C1/1036C22C9/00C22C26/00C22C1/1021
Inventor 武高辉芶华松林秀张强丁伟陈国钦修子杨姜龙涛熊美玲
Owner HARBIN INST OF TECH
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