High-thermal-conductivity low-dielectric-loss polyphenylene sulfide composite and preparation method thereof

Abstract

The invention provides a high-thermal-conductivity low-dielectric-loss polyphenylene sulfide composite and a preparation method thereof. The composite comprises 100 parts of polyphenylene sulfide resin, 10 to 40 parts of glass fibers, 30 to 60 parts of boron nitride, 5 to 15 parts of a compatilizer, 0.8 to 3.0 parts of a coupling agent, 1.0 to 5.0 parts of a dispersant and 0.4 to 1.2 parts of an anti-oxidant. The preparation method comprises the following steps: mixing boron nitride with the coupling agent so as to obtain a first mixture, adding the dispersant into the first mixture and carrying out mixing so as to obtain a second mixture; and mixing the polyphenylene sulfide resin, the compatilizer and the anti-oxidant, adding the obtained mixture into a screw extruder from a main feed inlet, adding the second mixture into the screw extruder from a lateral feed inlet, adding the glass fibers into the screw extruder from a glass fiber feeding inlet, and carrying out extrusion granulation via the screw extruder so as to obtain the polyphenylene sulfide composite in the form of granules. The polyphenylene sulfide composite provided by the invention has the advantages of high heat conduction coefficient and low dielectric loss and is applicable to the field of electrocommunication.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and relates to a modified polyphenylene sulfide composite material and a preparation method thereof. Background technique [0002] Polyphenylene sulfide has the characteristics of high temperature resistance, flame retardancy, high mechanical properties, excellent fluidity, and stable size. It is very suitable for electronic communication products to meet the requirements of temperature resistance, flame retardancy, and precision injection molding, so it is widely used in the electronic communication industry; However, polyphenylene sulfide itself has poor thermal conductivity and needs to be modified. Most of the current modification methods use thermally conductive fillers such as metal fibers, alumina, and silicon carbide to modify polyphenylene sulfide. Although it can improve its thermal conductivity, it increases the dielectric loss of the final composite material to varying degre...

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Problems solved by technology

[0002] Polyphenylene sulfide has the characteristics of high temperature resistance, flame retardancy, high mechanical properties, excellent fluidity, and stable size. It is very suitable for electronic communication products to meet the requirements of temperature resistance, flame retardancy, and precision injection molding, so it is widely used in the electronic communication industry; However, polyphenylene sulfide itself has poor thermal conductivity and needs to be modified

Most of the current modification methods use thermally conductive fillers such as metal fibers, alumina, and silicon carbide to modify polyphenylene sulfide. Although it can improve its thermal conductivity, it increases the dielectric loss of the final composite material to varying degrees and affects its performance. Wave transparency, which is not conducive to the transmission of communication signals, which limits its further application in the field of communication

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