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A method for manufacturing large-scale non-splicing micro-nano molds

A mold manufacturing, large-size technology, applied in the field of large-size non-splicing micro-nano mold manufacturing, to achieve the effects of high efficiency, low manufacturing cost and simple process

Active Publication Date: 2021-11-26
QINGDAO TECHNOLOGICAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing micro-nano manufacturing technologies such as electron beam lithography, focused ion beam manufacturing, and interference lithography face many shortcomings and limitations in the realization of large-scale jointless micro-nano mold manufacturing, such as processing cost, manufacturing cycle, and maximum patterning area. etc., especially the existing technology is almost impossible to realize the manufacture of large-size non-joint scale molds larger than 8 inches, which has become the biggest technical bottleneck restricting the extensive industrial application of large-area nanoimprinting and micro-nano patterning

Method used

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  • A method for manufacturing large-scale non-splicing micro-nano molds
  • A method for manufacturing large-scale non-splicing micro-nano molds
  • A method for manufacturing large-scale non-splicing micro-nano molds

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Embodiment 1

[0046] In this embodiment, a large-area sacrificial structure 2 is manufactured by thermal fusion electrohydrodynamic jet printing, and then the sacrificial structure 2 is transferred to a silicon substrate through an etching process, and the manufactured pattern structure is a wire grid structure. manufacturing process such as figure 1 As shown, the specific preparation steps include:

[0047] (1) Substrate 1 pretreatment: A1 plasma bombardment treatment of silicon substrate

[0048] Single crystal silicon or polycrystalline silicon is used as the substrate 1 (base). In order to improve the adhesion of the printed sacrificial structure 2 to the silicon substrate, a plasma treatment machine was used to conduct plasma bombardment treatment on the surface of the silicon substrate to improve the anti-adhesion performance of the silicon substrate.

[0049] (2) Manufacture of sacrificial structure 2: A2 uses thermal fusion electrohydrodynamic jet printing to manufacture sacrificial...

Embodiment 2

[0059] In this embodiment, the sacrificial structure 2 is manufactured by thermal fusion electrohydrodynamic jet printing, and then the sacrificial structure 2 is replicated through the electroforming process, and a large-sized micro-nano nickel mold without splicing is produced. The manufacturing process is as follows figure 2 As shown, the specific preparation steps include:

[0060] (1) Substrate 1 pretreatment: B1 ultrasonically cleans the glass substrate

[0061] Electrohydrodynamic jet printing substrate 1 pre-printed with glass as hot melt. The glass substrate was ultrasonically cleaned for 30 min, and then blown dry with nitrogen.

[0062] (2) Sputtering seed layer: B2 sputters a seed layer of about 100nm on the printed glass substrate

[0063] An electroformed seed layer 4 of Cr / Cu with a thickness of about 100 nm is sputtered on the glass substrate.

[0064] (3) Fabrication of sacrificial structure 2 by hot-melt electrohydrodynamic jet printing: B3 uses hot-melt ...

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Abstract

The invention discloses a method for manufacturing a large-scale non-splicing micro-nano mold, which includes the following steps: step 1: substrate pretreatment; step 2: manufacturing a sacrificial structure; The sacrificial structure is manufactured on the silicon substrate by jet printing; step 3: copy or transfer the sacrificial structure; use the printed sacrificial structure as a mask to copy or transfer the sacrificial structure to the substrate; step 4: remove the sacrificial structure; The sacrificial structure was removed, and then the substrate was ultrasonically treated with deionized water for 20 minutes to prepare a master template with the desired micro-nano structure pattern; step five: anti-adhesion treatment of the master template. The present invention combines the advantages of hot-melt electrohydrodynamic jet printing, etching or micro-electroforming to realize the manufacture of large-scale splicing-free micro-nano molds, especially with the ability to realize rapid and low-cost manufacturing of meter-scale non-splicing micro-nano molds unique advantage.

Description

technical field [0001] The present invention relates to a method for manufacturing a mold, more specifically to a method for manufacturing a large-size non-splicing micro-nano mold. Background technique [0002] In order to improve and improve the performance and quality of products in the fields of high-definition flat panel display, high-efficiency solar panels, anti-reflection and self-cleaning glass, LED patterning, and wafer-level micro-nano optical devices, there is a huge need for large-area micro-nano patterning technology. The common feature of these products is the need to manufacture large-area complex three-dimensional micro-nano structures efficiently and at low cost on large-scale non-flat rigid substrates (hard substrates or substrates) or fragile substrates. Large-size OLED, LCD, photovoltaic solar panels and other fields also have huge industrial demand for ultra-fine conductive patterns such as transparent electrodes. Nanoimprinting provides a solution wit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/00B29C59/02
CPCB29C59/02B29C2059/023B29C2059/028G03F7/0002
Inventor 兰红波许权赵佳伟彭子龙朱晓阳
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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