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A kind of preparation method of UV pressure-sensitive/moisture dual-cure polyurethane hot-melt adhesive

A polyurethane hot-melt adhesive and dual-cure technology, applied in polyurea/polyurethane adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problem of long holding time, slow curing of hot melt adhesives, and inability to quickly position And other problems, to achieve high bonding strength, fast bonding effect

Active Publication Date: 2020-10-02
信泰永合(烟台)新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the deficiencies in the above-mentioned prior art, and provides a preparation method of UV pressure-sensitive / moisture dual-curing polyurethane hot melt adhesive, which solves the problems of slow curing of hot melt adhesive, inability to quickly locate, and long holding time, and can greatly Shorten the pressure holding time of polyurethane hot melt adhesive, improve production efficiency, save pressure holding equipment expenses, and reduce manufacturing costs

Method used

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  • A kind of preparation method of UV pressure-sensitive/moisture dual-cure polyurethane hot-melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A preparation method of UV pressure-sensitive / moisture dual-cure polyurethane hot-melt adhesive, the steps are as follows:

[0023] (1) Vacuumize 47.5 parts of PPG1000 and 14 parts of PPG2000 at 90°C and 200r / min to remove water for 1 hour, and pass N 2 After the stirring, add 19 parts of TDI and continue stirring for 1 hour, then add 19 parts of hydroxyethyl acrylate and 0.5 parts of dibutyltin dilaurate and stir for 2 hours to prepare prepolymer A;

[0024] (2) 20 parts of prepolymer A of step (1), 15 parts of PPG1000, 15 parts of polyhexamethylene adipate diol of molecular weight 2000, 15 parts of polyethylene glycol phthalate of molecular weight 2000 Anhydride ester diol and 15 parts of Evonik acrylic resin 1420 were vacuumed at 90°C and 200r / min to remove water for 1 hour, and N 2 Protection, add 15.6 parts of molten MDI and 0.5 parts of N-methylolacrylamide after stirring and continue stirring for 2 hours, add 1 part of TPO, 2 parts of 184, 0.5 parts of KH590, 0....

Embodiment 2

[0026] A preparation method of UV pressure-sensitive / moisture dual-cure polyurethane hot-melt adhesive, the steps are as follows:

[0027] (1) Vacuumize 38 parts of PPG1000 and 23 parts of PPG2000 at 90°C and 200r / min to remove water for 1h, and pass N 2 After the stirring, add 10 parts of molten MDI and 10 parts of HDI and continue to stir for 1 hour, then add 7.5 parts of hydroxyethyl acrylate, 11 parts of hydroxypropyl acrylate and 0.5 parts of dibutyltin dilaurate and continue to stir for 2 hours to obtain the prepared Polymer A;

[0028] (2) 25 parts of prepolymer A of step (1), 15 parts of PPG1000, 15 parts of polyhexamethylene adipate diol of molecular weight 3000, 10 parts of polyethylene glycol phthalate of molecular weight 2000 Anhydride ester diol and 15 parts of Evonik acrylic resin 1420 were vacuumed at 90°C and 200r / min to remove water for 1 hour, and N 2 protection, add 15.6 parts of molten MDI and 0.8 parts of N-hydroxyethylacrylamide after stirring and conti...

Embodiment 3

[0030] A preparation method of UV pressure-sensitive / moisture dual-cure polyurethane hot-melt adhesive, the steps are as follows:

[0031] (1) Vacuumize 54.5 parts of PTMG1000 at 90°C and 200r / min to remove water for 1h, and pass N 2 Protection, add 10 parts of molten MDI and 12 parts of TDI after stirring and continue stirring for 1 hour, then add 5 parts of hydroxyethyl methacrylate, 18 parts of hydroxypropyl methacrylate and 0.5 parts of dibutyltin dilaurate and continue stirring for 2 hours , to obtain prepolymer A;

[0032] (2) 25 parts of prepolymer A of step (1), 15 parts of PPG1000 and 5 parts of PPG2000, 15 parts of polyhexamethylene adipate diol of molecular weight 2000, 10 parts of polyethylene glycol of molecular weight 1500 Phthalic anhydride ester diol and 10 parts of Evonik acrylic resin 1420 were vacuumed for 1 hour at 90°C and 200r / min stirring, and N 2 Protection, add 16.6 parts of molten MDI and 1 part of N-hydroxyethylacrylamide after stirring and continu...

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Abstract

The invention belongs to the technical field of adhesive and particularly relates to a preparation method of UV pressure-sensitive / moisture double-curing polyurethane hot melt adhesive. Hydroxy acrylamide in the hot melt adhesive generates pressure sensitivity after being subjected to UV / PUR illumination to achieve a key effect; UV irradiation is conducted after hot melt adhesive application and before adhesion, pressure is applied to an adhesion piece after adhesion, a certain time is maintained, and adhesive liquid can be crosslinked into an elastomer polymer in a viscoelastic state and haspressure sensitivity and high initial adhesion; pressing is conducted for 1 minute after assembling and adhesion, and the pull strength can reach to 1 to 2 MPa, so that rapid adhesion and positioningeffects are achieved; after pressing, moisture curing polyurethane reaction is continuously conducted and the pull strength after 24-hour curing can reach to 7 to 9 MPa, so that high adhesion strengthis guaranteed.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a preparation method of UV pressure-sensitive / moisture dual-curing polyurethane hot melt adhesive. Background technique [0002] Moisture-curing polyurethane hot melt adhesive refers to isocyanate group-terminated polyurethane prepolymer, which can react with moisture on the adherend in the air, and then cross-link and solidify. Due to its resistance to metal, plastic, wood, glass and other materials Both have good adhesion and bonding strength and are widely used. However, the existing moisture-curing polyurethane hot melt adhesives generally have the problem of slow curing rate. When components are bonded, it usually takes several hours of holding pressure after dispensing and bonding to achieve the required bonding. The strength seriously affects the efficiency of production; the use of pressure-holding equipment and processes requires a large investment in equi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J11/06C08G18/67C08G18/48C08G18/42C08G18/62C08G18/12
CPCC08G18/12C08G18/4063C08G18/4202C08G18/4808C08G18/6216C08G18/671C08G18/672C08K5/521C08K5/544C09J11/06C09J175/14C08G18/40
Inventor 徐彦威林志秀林绍盛
Owner 信泰永合(烟台)新材料有限公司
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