Surface-mounted safety capacitor chip material and preparation method thereof

A technology for safety capacitors and chip materials, which is applied in chemical instruments and methods, fixed capacitor dielectrics, and components of fixed capacitors, etc., can solve the problem that chip materials cannot meet the strength requirements, achieve the improvement of strength and K value, and solve the problem of strength. desired effect

Inactive Publication Date: 2018-05-25
KUSN WANSHENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention provides a SMD safety capacitor chip material and a preparation method, aiming to solve the technical problem that the chip material of the SMD capacitor in the prior art cannot meet the strength requirements after thinning

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  • Surface-mounted safety capacitor chip material and preparation method thereof
  • Surface-mounted safety capacitor chip material and preparation method thereof
  • Surface-mounted safety capacitor chip material and preparation method thereof

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Embodiment Construction

[0017] Exemplary embodiments of the present disclosure will be described in more detail below. Although exemplary embodiments of the present disclosure have been shown, it should be understood that the present disclosure can be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0018] The following is a SMD safety capacitor chip material and a preparation method provided by the embodiments of the present invention. The material and the preparation method can be specifically used to manufacture a chip substrate. The SMD safety capacitor chip material is obtained through the following proportions, each component is in powder or granular form, and the total weight is 500KG.

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Abstract

The invention provides a surface-mounted safety capacitor chip material. The chip material comprises the following components of 40-50% of strontium carbonate, 20-25% of titanium dioxide, 20-25% of calcium carbonate, 5-7% of bismuth trioxide and 3-5% of a filling material by weight. The invention also provides a preparation method of the surface-mounted safety capacitor chip material. The technical problem that the surface-mounted safety capacitor chip material in the prior art cannot satisfy the intensity requirement after thinning can be solved effectively.

Description

technical field [0001] The invention relates to the technical field of chip capacitors, in particular to a chip material and a preparation method of a chip safety capacitor. Background technique [0002] Capacitors are widely used electronic components in electronic equipment. According to different materials, the capacitors currently used include porcelain capacitors, mica capacitors, organic capacitors, and electrolytic capacitors. With the gradual development of electronic products in the direction of thinner and lighter, traditional capacitors have gradually been unable to adapt to this trend. The main reason is that the strength of traditional chip materials can only meet the manufacturing needs of ordinary thickness chips. When applied to thin chip capacitors, the chip needs to be thinner. At this time, the strength cannot meet its needs and it is easy to break, resulting in The failure of the overall product manufacturing affects the yield rate. Contents of the inv...

Claims

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Application Information

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IPC IPC(8): H01G4/12C04B35/64C04B35/46C04B35/505C01F11/18
CPCC01F11/18C01F11/186C04B35/46C04B35/505C04B35/64C04B2235/3232C04B2235/3298C04B2235/70H01G4/12H01G4/1218
Inventor 石怡吴伟程传波胡鹏房双杰
Owner KUSN WANSHENG ELECTRONICS
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