Process for separating and recovering cutting waste powder material of solar silicon wafer
A solar silicon wafer, separation and recycling technology, applied in the field of solar energy materials and separation and recycling, can solve the problems of bulky equipment, excessively long device process, waste of silicon powder, etc., and achieve the effect of improving separation efficiency, reducing water consumption and avoiding waste.
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[0013] Combine below figure 1 The present invention is further described.
[0014] A process for separating and reclaiming solar silicon chip cutting waste powder materials, comprising: a primary stirring bucket (1), a primary stirring bucket (1) discharge pipe through a pump (2) and a primary cyclone scrubber I ( 11) The feed pipes are connected; the primary cyclone scrubber I (11), the bottom flow pipe of the primary cyclone scrubber I (11) is connected with the secondary mixing barrel (3) feed pipe, the primary cyclone The overflow pipe of the scrubber I (11) is connected with the feed pipe of the solid-liquid separator I (12); the secondary stirring bucket (3), the discharge pipe of the secondary stirring bucket (3) passes through the pump (4) and The feed pipe of the secondary cyclone scrubber II (10) is connected; The overflow pipe of the secondary cyclone scrubber II (10) is connected with the feed pipe of the primary mixing bucket (1); the third-level mixing bucket (...
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