Ultrasonic vibration auxiliary micro-bulging device and method for thin-wall complex-curved-surface micro-structure component

Abstract

The invention discloses an ultrasonic vibration auxiliary micro-bulging device and method for a thin-wall complex-curved-surface micro-structure component, and relates to a thin-wall complex-curved-surface micro-structure forming device and method. The device and the method aim to solve the problem that the thin-wall complex-curved-surface micro-structure component cannot be manufactured by adopting an existing technology. The device comprises an upper connecting base, a lower connecting base, an ultrasonic vibration source, a male die, a female die and a material pressing plate, wherein the ultrasonic vibration source is arranged on the upper connecting base, the upper connecting base is vertically arranged on the lower connecting base in a sliding mode, the female die is arranged on thelower connecting base, the male die is arranged in an inner hole of the material pressing plate in a sliding mode, arrayed convex micro-structures are arranged on the lower surface of the male die, arrayed concave micro-structures are arranged on the upper surface of the female die, and the convex micro-structures are matched with the concave micro-structures. The micro-forming method comprises the following steps that 1, the device is assembled; and 2, a blank plate is subjected to micro-bulging so as to obtain the thin-wall complex-curved-surface micro-structure-array component.

Description

technical field [0001] The invention relates to a thin-wall complex curved surface microstructure forming device and method, in particular to a thin-wall complex curved surface microstructure array ultrasonic vibration-assisted micro-bulging device and method, belonging to the field of material forming. Background technique [0002] Thin-walled complex curved surface microstructure components, with their special curved surface structure, make this type of structure have multiple functions such as optics and thermal control, and have a wide range of application potentials in microelectronics and other industries. However, the wall thickness of this type of component is very small, usually within 100 μm, the maximum outer contour size of the structure is less than 10 mm, and the structure is a complex curved surface such as a spherical crown, a sinusoidal curve, etc. At present, this type of structure cannot be manufactured by traditional mechanical processing methods due to i...

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Problems solved by technology

[0003] The invention provides a micro-bulging device and method assisted by ultrasonic vibration of a thin-walled complex curved surface microstructure component, in order to solve the problem that the thin-walled complex curved surface microstructure component cannot be manufactured by the existing technology

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