Ultrasonic vibration auxiliary micro-bulging device and method for thin-wall complex-curved-surface micro-structure component

A technology of ultrasonic vibration and complex curved surface, which is applied in the field of material forming, can solve the problems such as the inability to manufacture microstructural components in the existing process, and achieve the effects of good consistency, increasing the bulging forming limit, and increasing the elongation.

Active Publication Date: 2018-05-01
HARBIN INST OF TECH
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  • Abstract
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Problems solved by technology

[0003] The invention provides a micro-bulging device and method assisted by ultrasonic vibration of a thin-walled complex curved surface microstructure component, in order to solve the problem that the thin-walled complex curved surface microstructure component cannot be manufactured by the existing technology

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  • Ultrasonic vibration auxiliary micro-bulging device and method for thin-wall complex-curved-surface micro-structure component
  • Ultrasonic vibration auxiliary micro-bulging device and method for thin-wall complex-curved-surface micro-structure component

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] see figure 1 Explain that the ultrasonic vibration-assisted micro-bulging device for thin-walled complex curved surface microstructure components includes an upper connecting seat 1, a lower connecting seat 2, an ultrasonic vibration source 3, a punch 4, a die 5, and a pressure plate 6;

[0019] The ultrasonic vibration source 3 is installed on the upper connecting seat 1, the upper connecting seat 1 is vertically slidably installed on the lower connecting seat 2, the die 5 is installed on the lower connecting seat 2, and the binder plate 6 is connected with the die 5 and between them Used to place the blank plate to be formed, the punch 4 is driven by the punch machine, the punch 4 is slidably set in the inner hole of the pressing plate 6, and the lower surface of the punch 4 has an array of raised microstructures 4-1, The upper surface of the ...

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Abstract

The invention discloses an ultrasonic vibration auxiliary micro-bulging device and method for a thin-wall complex-curved-surface micro-structure component, and relates to a thin-wall complex-curved-surface micro-structure forming device and method. The device and the method aim to solve the problem that the thin-wall complex-curved-surface micro-structure component cannot be manufactured by adopting an existing technology. The device comprises an upper connecting base, a lower connecting base, an ultrasonic vibration source, a male die, a female die and a material pressing plate, wherein the ultrasonic vibration source is arranged on the upper connecting base, the upper connecting base is vertically arranged on the lower connecting base in a sliding mode, the female die is arranged on thelower connecting base, the male die is arranged in an inner hole of the material pressing plate in a sliding mode, arrayed convex micro-structures are arranged on the lower surface of the male die, arrayed concave micro-structures are arranged on the upper surface of the female die, and the convex micro-structures are matched with the concave micro-structures. The micro-forming method comprises the following steps that 1, the device is assembled; and 2, a blank plate is subjected to micro-bulging so as to obtain the thin-wall complex-curved-surface micro-structure-array component.

Description

technical field [0001] The invention relates to a thin-wall complex curved surface microstructure forming device and method, in particular to a thin-wall complex curved surface microstructure array ultrasonic vibration-assisted micro-bulging device and method, belonging to the field of material forming. Background technique [0002] Thin-walled complex curved surface microstructure components, with their special curved surface structure, make this type of structure have multiple functions such as optics and thermal control, and have a wide range of application potentials in microelectronics and other industries. However, the wall thickness of this type of component is very small, usually within 100 μm, the maximum outer contour size of the structure is less than 10 mm, and the structure is a complex curved surface such as a spherical crown, a sinusoidal curve, etc. At present, this type of structure cannot be manufactured by traditional mechanical processing methods due to i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D22/22
Inventor 王春举单德彬郭斌万升祥刘洋张志强朱昌琼毕泽怡王磊磊徐杰
Owner HARBIN INST OF TECH
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