Method for preparing diamond/copper composite material by combining 3D printing technology

Abstract

The invention provides a method for preparing a diamond / copper composite material by combining a 3D printing technology and belongs to the field of diamond composite materials. Through a salt bath plating technology, a layer of even Cr7C3 is plated on the surface of diamond so as to improve the wettability of diamond and copper, then copper plating continues to be conducted on the surface of the Cr7C3 layer through a chemical plating mode, the thickness of a copper plating layer is controlled by controlling the content of Cu<2+> in a plating solution, and thus double-plating-layer Cu-Cr7C3-Diamond powder is prepared. Through the 3D printing technology, the double-plating-layer diamond powder is subjected to laser cladding, the copper-plated layer on the surfaces of diamond particles is melted to be mutually stuck to form a porous prefabricated blank skeleton with a specific shape, and then the porous prefabricated blank skeleton is placed into a split graphite mold to be prepared intoa diamond / copper composite material part with a complex shape through pressureless infiltration of a copper solution. According to the method for preparing the diamond / copper composite material by combining the 3D printing technology, the composite material with the even structure and high compactness can be prepared, the diamond / copper composite material part with the complex shape can further bedirectly prepared, the difficulty that a diamond / copper composite material is hard to machine is overcome, and customized production can be conducted according to the requirement.

Description

technical field [0001] The invention belongs to the forming technology of metal matrix composite material parts, and in particular provides a method for preparing Diamond / Cu (diamond / copper) composite material parts with complex shapes in combination with 3D printing technology. The preparation of customized, high-performance metal matrix composite parts has been realized. Background technique [0002] Diamond / Cu composite material is made of copper with good thermal conductivity and diamond with low thermal expansion coefficient and high thermal conductivity. Generally, the density of Diamond / Cu composite material is only 5.9g / cm 3 , while the thermal conductivity can reach 500W·m -1 ·K -1 At the same time, the thermal conductivity and thermal expansion coefficient of the composite material can be adjusted by controlling the volume fraction of the diamond reinforcement, so it is an ideal electronic packaging material. With the continuous deepening of the research on Diam...

AI Technical Summary

Problems solved by technology

Since this method uses powder metallurgy molding technology to prepare diamond preforms, the density of the preforms is not uniform, and the complexity of the shape of the parts is also greatly limited.

At the same time, due to the lack of moisture between the diamond and Cu, it is difficult to achieve complete penetration even with various forms of pressurized infiltration techniques, often leaving a certain amount of pores, and even if the preform is degreased, there will still be a forming agent remaining in the diamond. The surface reduces the performance of the material, which is a fatal weakness for electronic packaging materials

In addition, the machining of Diamond / Cu composites with a high volume fraction in the matrix is ​​extremely difficult, which has also become a bottleneck for the practical application of this material.

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