BGA repair method, apparatus and system
A device pairing and rework station technology, applied in printed circuit repair/correction, printed circuit secondary treatment, post-manufacturing process, etc., can solve problems such as high temperature expansion, affecting BGA chip reliability and life, BGA high temperature bubbles, etc., to achieve Reduce the impact, improve the efficiency of rework work, improve the life and reliability of the effect
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[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0039] The embodiment of the present invention discloses a kind of BGA rework method, with reference to figure 2 As shown, the method includes:
[0040] Step S21: performing heat treatment on the BGA on the faulty board to remove the BGA from the faulty board to obtain a BGA to be processed.
[0041] Wherein, the above-mentioned faulty board refers to a problematic PCB board. It can be understood that, in this step, before heating the BGA of the above fault...
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