A high-temperature planar transformer using metal-clad ceramic substrates

Abstract

A high-temperature planar transformer using metal-bonded ceramic substrates, including a double-ring closed structure magnetic core spliced ​​by a group of iron-nickel-molybdenum metal magnetic powder cores; multiple groups of ceramic substrate planes using metal-bonded technology coils, and all planar coil assemblies make up the primary and secondary windings of the transformer. The ceramic substrate used in the high-temperature planar transformer has a mounting hole for placing a magnetic core made of metal magnetic powder core, and two parts of the magnetic core are respectively put into the mounting hole from both sides of the ceramic substrate, and bonded together as a whole. Compared with traditional wire-wound transformers and planar transformers, the present invention is a high-temperature planar transformer using metal-bonded ceramic substrates. Inductance and distributed capacitance, improve heat dissipation efficiency, and can work for a long time in a high temperature environment above 200 ℃, so that the heat dissipation design of the transformer can be simplified, the size and weight of the transformer can be reduced, and it also meets the high temperature requirements of aerospace, oil drilling, etc. Design requirements for switching power supplies in the environmental industry.

Description

technical field [0001] The invention designs a planar transformer, mainly a high-temperature planar transformer using metal bonding ceramic substrates. Background technique [0002] Traditional planar transformers mostly use flat enameled wire winding technology, PCB printed circuit technology, or a hybrid structure of the two. The flat enameled wire winding process has a large volume, high leakage inductance, and poor consistency; the PCB printed circuit coil has a compact structure, but it cannot work at high frequency and high temperature. The PCB printed circuit process can also be replaced by a low-temperature co-fired ceramic LTCC process to enhance high-frequency performance, but the low-temperature co-fired ceramic process is formed by printing metal paste on the green tape and co-sintering, due to the shrinkage of the metal paste and the green tape The rate is inconsistent, and the width and thickness of the printed metal wires are limited, which cannot withstand l...

AI Technical Summary

Problems solved by technology

The flat enameled wire winding process has a large volume, high leakage inductance, and poor consistency; the PCB printed circuit coil has a compact structure, but it cannot work at high frequency and high temperature

The PCB printed circuit process can also be replaced by a low-temperature co-fired ceramic LTCC process to enhance high-frequency performance, but the low-temperature co-fired ceramic process is formed by printing metal paste on the green tape and co-sintering, due to the shrinkage of the metal paste and the green tape The rate is inconsistent, the printed metal wire width and thickness are limited, and cannot withstand large currents

The planar transformers used in traditional switching power supplies generally use ferrite cores. The Curie temperature is low, and the magnetic permeability decreases at high temperatures, making it unable to work normally. Drilling and other industries with high temperature environments have design requirements for high temperature and high power density of planar transformers in switching power supply modules

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