Additive for acidic etching solution and the acidic etching solution

Abstract

The invention discloses an additive for acidic etching solution and the acidic etching solution. The additive includes, by mass, 1-200 parts of a nonionic surfactant and 1-200 parts of a stabilizer, wherein the stabilizer is at least one of sulfur-containing urea, mercaptan and bromides. The acidic etching solution comprises an etching basic liquid and the additive. The acidic etching solution canbe used for producing printed circuit boards, which has thick copper layer (copper thickness being 70 [mu]m or higher) or large to-be-etched area (to-be-etched area being more than 50%, especially whole-plate etching), and is free of instable or low speed during the etching. In addition, the additive can be used for directly producing bulk copper plates in a circuit board etching process withoutextra addition of an electrolysis additive.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing industry, in particular to an acid etching solution additive and an acid etching solution. Background technique [0002] In the manufacturing process of printed circuit boards, chemical reactions are usually used to remove unnecessary parts on the circuit board to form required circuit patterns. Acid etching solution refers to corroding copper-clad laminates in the printed circuit board manufacturing industry, removing copper that is not protected by ink or dry film to obtain circuit patterns, and acidic copper chloride solution is often used. [0003] In the existing manufacturing process of printed circuit boards, in order to obtain a fast and stable etching rate, it is often necessary to add a strong oxidizing agent (the oxidizing agent used to oxidize monovalent copper to divalent copper in acid copper chloride etching solution) in the etching solution. , such as h...

AI Technical Summary

Problems solved by technology

[0006] The invention provides a group of additives made of non-ionic surfactant, bromide ion compound, sulfur-containing urea, and mercaptan as stabilizers to solve the problem of producing thin copper or having a small area to be etched by an acidic etching solution that does not use a strong oxidant In the process of turning the circuit boards to produce circuit boards with thicker copper and larger areas to be etched, the etching rate first decreased and then stabilized.

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