Femtosecond laser micromachining method and device

A femtosecond laser and micromachining technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems affecting processing quality and processing accuracy, recasting layers in processing areas, thermal deformation and cracks, etc., to achieve improved Processing quality and processing accuracy, the effect of avoiding the heat-affected zone

Active Publication Date: 2018-02-23
武汉光谷航天三江激光产业技术研究院有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The embodiment of the present invention provides a femtosecond laser micromachining method and device, which solves the problem of heat-affected zone, recast layer, thermal deformation and cracks in the processing area in the femtosecond laser micromachining process in the pr

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  • Femtosecond laser micromachining method and device

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Embodiment 1

[0032] The embodiment of the present invention provides a femtosecond laser micromachining method, please refer to figure 1 , the method includes:

[0033] Step 10: coating the surface of the base material.

[0034] Specifically, electron beam evaporation is used to coat the surface of the base material to avoid phenomena such as heat-affected zones, recast layers, thermal deformation and cracks during processing.

[0035] Step 20: focusing the femtosecond pulsed laser beam onto the upper surface of the coating base material.

[0036] Specifically, the femtosecond pulsed laser beam is focused on the upper surface of the coated base material to prepare for subsequent micro-hole processing on the upper surface of the coated base material.

[0037] Step 30: Writing a microhole pattern on the upper surface of the coating base material.

[0038] Specifically, the computer controls the femtosecond pulsed laser beam to write the required microhole pattern on the upper surface of t...

Embodiment 2

[0051] The embodiment of the present invention provides a femtosecond laser micromachining device, please refer to figure 2 , the device includes:

[0052] femtosecond laser1.

[0053] Specifically, the femtosecond laser 1 emits a femtosecond pulsed laser beam with a wavelength of 800 nm, a pulse width of 45 fs, and a pulse frequency of 1 kHz.

[0054] Mirror 4.

[0055] Specifically, the reflector 4 receives the femtosecond pulsed laser beam emitted by the femtosecond laser 1, and reflects the femtosecond pulsed laser beam to the microscopic objective lens 6, and the reflector 4 plays a role in changing the Technical effects of femtosecond pulsed laser beam paths.

[0056] Microscope objective 6.

[0057] Specifically, the microscopic objective lens 6 receives the femtosecond pulsed laser beam reflected from the mirror 4, and focuses the femtosecond pulsed laser beam.

[0058] Electronically controlled translation stage 8.

[0059] Specifically, the material 7 to be pr...

Embodiment 3

[0069] Embodiments of the present invention provide specific process steps of a femtosecond laser micromachining method, please refer to figure 1 , figure 2 .

[0070] Step 1: Preparation of coating base material.

[0071] A 10-fused silica sample with a size of 10mm×10mm×0.5mm and polished six sides was used as the base material, and copper, aluminum, and silver were used as coating materials, and the coating sequence was silver, copper, and aluminum. Electron beam evaporation technology is used to prepare coating samples in the vacuum chamber of the electron beam evaporation system. The base material was cleaned in an ultrasonic bath in ethanol, acetone and deionized water for 10 minutes, dried with nitrogen, and quickly placed in the vacuum chamber of the electron beam evaporation system, and the film material was put into the corresponding crucible, and then Evacuate the electron beam evaporation system to above 10 -3 Pa, then raise the temperature of the substrate su...

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Abstract

The invention discloses a femtosecond laser micromachining method and device. The method comprises the steps that coatings are formed on the upper surface of substrate materials; femtosecond pulse laser beam focuses on the upper surface of the coated substrate materials; microporous patterns are formed in the upper surface of the coated substrate materials; the coated substrate materials with themicroporous patterns formed are placed into a reaction solution, and the coatings are removed by washing; and the substrate materials with the coatings removed are taken out, and the substrate materials with the microporous patterns through femtosecond pulse laser micromachining are obtained after ultrasonic bath. With the above method, the technical problem that the machining quality and machining precision are affected by heat-affected areas, recast layers, thermal deformation, cracks and so forth existing in machining areas in the femtosecond laser micromachining process in the prior art are solved, and the technical effects that the heat-affected areas, recast layers, thermal deformation, cracks and so forth are avoided and the machining quality and machining precision are improved areachieved.

Description

technical field [0001] The invention relates to the field of laser micromachining, in particular to a femtosecond laser micromachining method and device. Background technique [0002] Due to the rapid development of information, biotechnology, energy, military, etc., components are becoming more and more intelligent, highly integrated, and miniaturized. Micro-nano-sized high-quality hole arrays cover almost all manufacturing industries due to their wide range of applications. attention. Due to the extremely short pulse width of the femtosecond laser, it can obtain extremely high peak power at relatively low pulse energy, which can reach one trillion watts. Due to the two main characteristics of short pulse width and high power, femtosecond laser micromachining has been widely used in many disciplines and has great application potential. [0003] However, in the process of implementing the technical solutions in the embodiments of the present application, the inventors of t...

Claims

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Application Information

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IPC IPC(8): B23K26/0622B23K26/18B23K26/064B23K26/70
CPCB23K26/0643B23K26/18B23K26/0624B23K26/064B23K26/702
Inventor 王竹萍王才良范小康孙禹刘娟娟
Owner 武汉光谷航天三江激光产业技术研究院有限公司
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