OLED packaging structure and OLED packaging method

Abstract

The invention provides an OLED packaging structure and an OLED packaging method. The OLED packaging structure comprises a TFT substrate (1), a packaging cover plate (3), an OLED device (5), and frameadhesive (7), wherein the packaging cover plate (3) is arranged opposite to the TFT substrate (1); the OLED device (5) is arranged in an effective display region (AA) of the OLED and on one side, close to the packaging cover plate (3), of the TFT substrate (1); the frame adhesive (7) is arranged on the periphery of the effective display region (AA) of the OLED and between the TFT substrate (1) andthe packaging cover plate (3); the packaging cover plate (3) comprises a packaging substrate (31) and an UV barrier layer (33) which is arranged on one side, close to the TFT substrate (1), of the packaging substrate (31) and corresponding to the effective display region (AA) of the OLED; and the UV barrier layer (33) is a transparent thin film with low UV light transmittance and high visible light transmittance, so that influence to the electrical performance and stability of the TFT in frame adhesive (7) curing process by UV light can be lowered, water vapor and oxygen are further isolated,and the service life of the OLED device (5) is prolonged.

Description

technical field [0001] The invention relates to the technical field of OLEDs, in particular to an OLED packaging structure and an OLED packaging method. Background technique [0002] Organic Light Emitting Diode (OLED) has self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide operating temperature range, and can realize flexible display and large It has many advantages such as area full-color display, and is widely used in the fields of display, lighting, and smart wear. [0003] OLED devices are usually set on a thin film transistor array substrate (Thin Film Transistor Array Substrate, TFT Array Substrate, referred to as TFT substrate), including an anode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron Transport layer, electron injection layer and cathode. The TFT in the TFT substrate is used as a switching device and a driving devi...

AI Technical Summary

Problems solved by technology

[0006] There are certain disadvantages in the existing OLED packaging methods, which are mainly manifested in: in the process of curing the frame glue by UV light irradiation, due to the high energy of the UV tube, the TFT will generate carriers (electrons or space) under the UV light. hole), when the free carrier concentration increases, the threshold voltage (Vth) of the TFT will decrease, and the drift of Vth will directly cause the luminance of the OLED pixel to change, thus affecting the overall display quality of the OLED; that is, UV light irradiation will destroy the electrical properties and stability of the TFT in the TFT substrate

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