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MEMS device, manufacturing method thereof and electronic device

An electronic device and device technology, applied in the field of MEMS device and its manufacturing method and electronic device, can solve problems such as pattern layer offset and product failure, and achieve the effects of improving yield, reducing process cost and avoiding alignment offset

Inactive Publication Date: 2018-01-23
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the lithography alignment (photo alignment) mark formed in the first wafer in the subsequent process will be covered by the second wafer, which will cause the shift of the pattern layer in the subsequent alignment process, resulting in the product being different from the upper and lower parts. Failed due to layer alignment shift

Method used

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  • MEMS device, manufacturing method thereof and electronic device
  • MEMS device, manufacturing method thereof and electronic device
  • MEMS device, manufacturing method thereof and electronic device

Examples

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preparation example Construction

[0038] In order to solve the problems existing in the current technology, the present invention provides a method for preparing a MEMS device, comprising:

[0039] providing a first wafer in which a number of alignment marks are formed;

[0040] providing a second wafer and bonding the second wafer integrally with the first wafer;

[0041] The second wafer is diced to form dicing lines to expose the alignment marks.

[0042] Wherein, a scribe line area is formed in the first wafer, and the alignment mark is formed in the scribe line area.

[0043] The dicing line area in the first wafer corresponds vertically to the dicing line expected to be formed in the second wafer, so as to ensure that the alignment marks can be exposed after dicing the second wafer.

[0044] Wherein, the shape of the alignment mark is not limited to a certain one, and may be a square, a circle, a cross and various easily identifiable patterns.

[0045] Wherein, the number of the alignment marks is not l...

Embodiment 1

[0057] Next, the detailed steps of an exemplary method of the MEMS device manufacturing method proposed by the embodiment of the present invention will be described with reference to the accompanying drawings. in, figure 1 It is a schematic flow chart of a manufacturing method of a MEMS device according to another embodiment of the present invention; Figure 2A-Figure 2C It is a cross-sectional view of a structure formed in the relevant steps of a MEMS device manufacturing method in an embodiment of the present invention.

[0058] Such as figure 1 As shown, a method for manufacturing a MEMS device according to another embodiment of the present invention specifically includes:

[0059] Step S1: providing a first wafer in which several alignment marks are formed;

[0060] Step S2: providing a second wafer and bonding the second wafer to the first wafer;

[0061] Step S3: dicing the second wafer to form dicing lines in the second wafer and exposing the alignment marks in the ...

Embodiment 2

[0117] The present invention also provides a MEMS device, which can be prepared by the method of the first embodiment.

[0118] The MEMS devices include:

[0119] first wafer 201;

[0120] an alignment mark 202 located in the first wafer;

[0121] The second wafer 204 is bonded to the first wafer 201;

[0122] Wherein, a dicing line 203 is formed in the second wafer 204 to expose the alignment marks in the first wafer.

[0123] Specifically, the first wafer 201 includes at least a semiconductor substrate, and the semiconductor substrate may be at least one of the materials mentioned below: silicon, silicon-on-insulator (SOI), silicon-on-insulator (SSOI) ), silicon germanium on insulator (S-SiGeOI), silicon germanium on insulator (SiGeOI) and germanium on insulator (GeOI), etc.

[0124] In the present invention, the first wafer 201 is made of bare silicon.

[0125] Device patterns are formed on the front surface of the first wafer 201 .

[0126] Specifically, a groove is ...

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Abstract

The invention provides an MEMS device, a manufacturing method thereof and an electronic device. The method comprises the following steps: providing a first wafer, and forming a plurality of alignmentmarks in the first wafer; providing a second wafer, and joining the second wafer with the first wafer; cutting the second wafer to form a cutting channel in the second wafer, and exposing the plurality of alignment marks in the cutting channel. The MEMS device has the advantages that: (1) the alignment marks are completely exposed by a cutting method, the alignment marks are well integrated with the cutting process to avoid adding additional steps, and the process cost is further reduced. (2) The yield of the product is improved. (3) The problem of alignment offset is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a MEMS device, a manufacturing method thereof, and an electronic device. Background technique [0002] With the continuous development of semiconductor technology, in the market of sensor (motion sensor) products, smart phones, integrated CMOS and micro-electromechanical system (MEMS) devices have increasingly become the most mainstream and advanced technology, and with the update of technology, The development direction of this kind of transmission sensor products is smaller size, high-quality electrical performance and lower loss. [0003] Among them, MEMS sensors are widely used in automotive electronics: such as TPMS, engine oil pressure sensor, air pressure sensor of automobile brake system, automobile engine intake manifold pressure sensor (TMAP), common rail pressure sensor of diesel engine; consumer electronics: such as tire pressure gauge , sphygmomanometer, cabi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00
Inventor 王伟郑超
Owner SEMICON MFG INT (SHANGHAI) CORP
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