LED (Light-emitting diode) encapsulating material with high hardness and excellent bonding strength and preparation method of LED encapsulating material

A technology of LED packaging and bonding strength, which is applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problem of affecting the service life of LED products, affecting the mechanical properties of packaging materials, and reducing the quality of LED products To achieve important market value and social value, easy to promote and use, and quality assurance

Inactive Publication Date: 2017-12-22
陈贤尧
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing LED packaging materials have the defects of low hardness and poor bonding strength. The low hardness will affect the mechanical properties of the packaging materials, and the poor bonding strength will reduce the quality of LED products and affect the quality of LED products. service life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] An LED packaging material with high hardness and excellent bonding strength, made of the following raw materials in parts by weight: 45 parts of cycloaliphatic epoxy resin, 20 parts of diaminodiphenylmethane tetraglycidylamine, carboxyl-terminated liquid butyronitrile 6 parts of rubber, 2 parts of polyimide, 8 parts of methyl ethoxy silicone oil, 1 part of triphenylmethane triisocyanate, 0.3 part of yttrium isopropoxide, and 2 parts of modified titanium sol.

[0025] Wherein, the modified titanium sol is prepared by the following method: take 60% of the total amount of titanium sol, add a citric acid aqueous solution with a concentration of 15%, put it into the reaction kettle, stir and mix at 75°C and 300rpm for 40min, and Cool down the reaction kettle to 50°C, add the ethanol solution of methyl carbamate, continue to stir and mix for 30 minutes, let it stand for 1 hour, discharge the material, evaporate to dryness under negative pressure, put the evaporated solid mater...

Embodiment 2

[0033] An LED packaging material with high hardness and excellent bonding strength, made of the following raw materials in parts by weight: 46 parts of cycloaliphatic epoxy resin, 21 parts of diaminodiphenylmethane tetraglycidylamine, carboxyl-terminated liquid butyronitrile 9 parts of rubber, 4 parts of polyimide, 9 parts of methyl ethoxy silicone oil, 1.5 parts of triphenylmethane triisocyanate, 0.6 parts of yttrium isopropoxide, and 2.7 parts of modified titanium sol.

[0034] Wherein, the modified titanium sol is prepared by the following method: take a total of 62% of the titanium sol, add a citric acid aqueous solution with a concentration of 15%, put it into the reaction kettle, stir and mix at 75°C and 350rpm for 42min, and Cool down the reaction kettle to 50°C, add the ethanol solution of methyl carbamate, continue to stir and mix for 35 minutes, let it stand for 1 hour, discharge the material, evaporate to dryness under negative pressure, put the evaporated solid mate...

Embodiment 3

[0042]An LED packaging material with high hardness and excellent bonding strength, made of the following raw materials in parts by weight: 47 parts of cycloaliphatic epoxy resin, 22 parts of diaminodiphenylmethane tetraglycidylamine, carboxyl-terminated liquid butyronitrile 8 parts of rubber, 3.7 parts of polyimide, 10 parts of methyl ethoxy silicone oil, 2 parts of triphenylmethane triisocyanate, 0.5 parts of yttrium isopropoxide, and 2.5 parts of modified titanium sol.

[0043] Wherein, the modified titanium sol is prepared by the following method: take 63% of the total amount of titanium sol, add a citric acid aqueous solution with a concentration of 15%, put it into the reaction kettle, stir and mix at 78°C and 350rpm for 45min, and Cool the reaction kettle to 52°C, add the ethanol solution of methyl carbamate, continue to stir and mix for 35 minutes, let it stand for 1.5 hours, discharge the material, evaporate to dryness under negative pressure, put the evaporated solid m...

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PUM

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Abstract

The invention discloses an LED (light-emitting diode) encapsulating material with high hardness and excellent bonding strength. The LED encapsulating material is prepared from the following raw materials in parts by weight: 45 to 49 parts of cycloaliphatic epoxy resin, 20 to 24 parts of diamino diphenylmethane tetraglycidylamine, 6 to 10 parts of terminal carboxyl liquid nitrile rubber, 2 to 5 parts of polyimide, 8 to 12 parts of methyl-ethyloxy silicone oil, 1 to 3 parts of triphenyl methane triisocyanate, 0.3 to 0.7 part of yttrium isopropoxide and 2 to 3 parts of modified titanium sol. The invention also discloses a preparation method of the LED encapsulating material with high hardness and excellent bonding strength. The encapsulating material prepared by the invention has relatively high hardness and bonding strength; the refractive index can meet the market requirement, the quality of an LED can be ensured, and the service life of the LED can be prolonged.

Description

technical field [0001] The invention relates to the technical field of LED packaging materials, in particular to an LED packaging material with high hardness and excellent bonding strength and a preparation method thereof. Background technique [0002] LED is a semiconductor electronic component that converts electrical energy into light energy. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the luminosity has also increased to a considerable extent. of luminosity. LED is called the fourth-generation light source, which has the characteristics of energy saving, environmental protection, safety, long life, low power consumption, low heat, high brightness, waterproof, miniature, shockproof, easy dimming, concentrated beam, easy maintenance, et...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J113/00C09J11/08C09J11/06C09J11/04
CPCC08K2003/2241C08L2203/206C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C08L13/00C08L79/08C08L83/06C08K9/04C08K3/22C08K5/057
Inventor 陈贤尧
Owner 陈贤尧
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