Fine-pitch single IC chip packaging part and preparation method therefor
A technology of chip packaging and details, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc. It can solve problems such as difficulty in controlling the diameter of bonding balls, damage to the previous wire, and short-circuiting of adjacent solder joints. Achieve the effect of avoiding short circuit of adjacent solder joints, reducing the punching rate of plastic packaging, and excellent bonding strength
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[0033] A kind of fine-pitch single IC chip package of the present invention, its structure is as Figure 1 to Figure 4 shown, by Figure 1 to Figure 4 It can be seen that it mainly includes a plastic package body 1, and a lead frame carrier 2 and a plurality of frame lead inner pins 3 are arranged in the plastic package body 1, and an IC chip 4 is fixed on the upper surface of the lead frame carrier 2 through an adhesive. A plurality of bonding pads 5 are provided on the upper surface of the chip 4 . The pads 5 are arranged in parallel in two rows to form a first pad group and a second pad group. Each pad 5 is respectively connected to a pin 3 in the frame lead through a copper bonding wire. Aluminum electroplating layers 6 are arranged at intervals on the upper surfaces of the plurality of pads 5 in each pad group. The pads 5 provided with the aluminum electroplating layer 6 in one pad group correspond to the positions of the pads 5 not provided with the aluminum electropl...
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