Device and method for wafer laser processing
A laser processing and wafer technology, applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve the problems of Low-K material adhesion and detachment, thermal burning phenomenon in the center of the spot, and reduce chip yield, etc. beam handling capacity, small heat-affected zone, and high uniformity
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[0065] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0066] Embodiments of the present invention provide a device for laser processing wafers, such as figure 1 As shown, the device includes:
[0067] a laser for emitting a laser beam;
[0068] A beam expander and collimator element is used to expand and collimate the laser beam to form a parallel beam;
[0069] Phase-controlled liquid crysta...
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