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Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board

A technology of printed circuit board and carrier copper foil, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc., and can solve the problems of poor formation of micro-circuits and reduced circuit intervals, etc.

Active Publication Date: 2017-12-01
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is necessary to reduce the circuit spacing in consideration of more etching amount, so it can be said that the MSAP method is slightly inferior to the SAP method in terms of fine circuit formation.

Method used

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  • Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
  • Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
  • Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0074] The present invention will be described more specifically by the following examples.

example 1～6

[0076] Preparation and evaluation of the roughened copper foil with carrier foil were performed as follows.

[0077] (1) Production of carrier foil

[0078] A copper sulfate solution having the composition shown below was used as the copper electrolyte; a titanium rotating electrode having an arithmetic average surface roughness Ra (according to JIS B 0601: 2001) of 0.20 μm was used as the cathode; DSA (dimensional stability anode), at a solution temperature of 45°C and a current density of 55A / dm 2 Electrolysis was carried out under the hood to obtain an electrolytic copper foil with a thickness of 12 μm as a carrier foil. At this time, as the rotating cathode, an electrode whose surface was polished with #1000 polishing to adjust the surface roughness was used. The ten-point average roughness Rzjis of the electrode-side surface of the obtained carrier foil was measured in accordance with JIS B0601:2001, and it was 0.9 μm. In addition, the ten-point average roughness Rzjis...

example 7

[0132] Example 7 (Compare)

[0133] In the roughening treatment, the electric quantity Q in the plating process of the first stage 1 Relative to the electric quantity Q in the plating process of the second stage 2 ratio (Q 1 / Q 2 ) was less than 1.5, except that, it performed similarly to the procedure described about Examples 1-6, and performed preparation and evaluation of the tape carrier roughening process copper foil.

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Abstract

Provided is a roughened copper foil which, when used in the SAP method, can endow a laminate with a surface profile excellent not only in plated circuit adhesion but also in etching performance for electroless copper plating and dry film resolution. This roughened copper foil has a roughened surface on at least one side, wherein: the roughened surface is provided with a plurality of substantially spherical projections composed of copper particles; the mean height of the substantially spherical projections is 2.60 [mu]m or less; and the ratio bave / aave of the mean maximum diameter bave of the substantially spherical projections to the mean neck diameter aave of the substantially spherical projections is 1.2 or higher.

Description

technical field [0001] The invention relates to a roughened copper foil, a copper foil with a carrier, a copper-clad laminate and a printed circuit board. Background technique [0002] In recent years, the SAP (semi-additive process) method has been widely used as a method of manufacturing printed wiring boards suitable for miniaturization of circuits. The SAP method is extremely suitable for forming a fine circuit, and as an example, copper foil is roughened using a tape carrier. For example, if figure 1 and 2 As shown, using a prepreg 12 and a primer layer 13, an ultra-thin copper foil 10 having a roughened surface and an insulating resin substrate 11 having a lower layer circuit 11b on a base substrate 11a are pressure-bonded to make them tightly bonded. (step (a)); after peeling off the carrier foil (not shown), if necessary, via hole 14 is formed by laser drilling (step (b)). Next, the ultra-thin copper foil is removed by etching to expose the primer layer 13 that p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06B32B15/20C25D5/16H05K3/18H05K3/38
CPCB32B15/20C25D7/06H05K3/18H05K3/38C25D5/605C25D1/04H05K3/382H05K3/384H05K2203/0307H05K2203/0723H05K1/09H05K3/188C25D7/0614
Inventor 饭田浩人松田光由吉川和广河合信之加藤翼
Owner MITSUI MINING & SMELTING CO LTD
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