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Soldering flux for circuit board patch and preparation method thereof

A flux, board patch technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of infiltration into the ground, dissolved into the groundwater system, endangering human and animal health, unsatisfactory welding performance, etc. Less, less residue after welding, good application prospects

Inactive Publication Date: 2017-11-21
HEFEI TONGYOU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional solder paste products are composed of tin-lead solder powder and flux. After the PCB is soldered, the heavy metal lead in the solder paste will be scattered in the environment with the discarded electronic products in the future. After long-term corrosion by acid rain, the lead will seep into the ground , Dissolved into the groundwater system, long-term accumulation in the body of humans or animals after drinking will cause heavy lead poisoning, endangering the health of humans and animals. Just because people are aware of the importance of protecting the environment, environmental protection laws and regulations are also becoming more and more strict.
Therefore, the application of lead-free soldering flux in the field of microelectronic surface assembly technology is unavoidable. There are few types of lead-free soldering flux, some are easy to dry, and some have unsatisfactory soldering performance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A soldering flux for circuit board patch, which is composed of the following raw materials in parts by weight: 70 parts of rosin modified phenolic resin, 35 parts of rosin glyceride, 25 parts of succinic acid, 20 parts of dodecyl alcohol fat, 15 parts of acrylate 10 parts of benzotriazole, 5.5 parts of benzimidazole, 7 parts of acrylonitrile, 5 parts of nano silver, 7 parts of phenyl glycidyl ether, 12 parts of triethanolamine, 5.5 parts of organic solvent, 4 parts of additives and 50 parts of ionized water;

[0024] The auxiliary agent is composed of the following raw materials in parts by weight: 3 parts of surfactant, 3.5 parts of film-forming agent, 2 parts of stabilizer and 0.5 part of thixotropic agent.

[0025] Wherein, the particle size of the nano-silver is 40nm.

[0026] Wherein, the organic solvent is one or a mixture of two or more of ethanol, propanol, butanol, vinyl acetate and butyl acetate.

[0027] Wherein, the surfactant is sodium dodecylbenzenesulfo...

Embodiment 2

[0035] A soldering flux for circuit board patch, which is composed of the following raw materials in parts by weight: 60 parts of rosin modified phenolic resin, 30 parts of rosin glyceride, 20 parts of succinic acid, 10 parts of lauryl alcohol fat, 10 parts of acrylate 5 parts of benzotriazole, 3 parts of benzimidazole, 5 parts of acrylonitrile, 2 parts of nano silver, 5 parts of phenyl glycidyl ether, 8 parts of triethanolamine, 3 parts of organic solvent, 2 parts of additives and 40 parts of ionized water;

[0036] The auxiliary agent is composed of the following raw materials in parts by weight: 1 part of surfactant, 2 parts of film-forming agent, 0.5 part of stabilizer and 0.2 part of thixotropic agent.

[0037] Wherein, the particle size of the nano-silver is 30nm.

[0038] Wherein, the organic solvent is one or a mixture of two or more of ethanol, propanol, butanol, vinyl acetate and butyl acetate.

[0039] Wherein, the surfactant is sodium dodecylbenzenesulfonate or f...

Embodiment 3

[0047] A soldering flux for circuit board patch, which is composed of the following raw materials in parts by weight: 80 parts of rosin modified phenolic resin, 40 parts of rosin glyceride, 30 parts of succinic acid, 30 parts of dodecyl alcohol fat, 20 parts of acrylate 15 parts of benzotriazole, 8 parts of benzimidazole, 10 parts of acrylonitrile, 8 parts of nano silver, 10 parts of phenyl glycidyl ether, 15 parts of triethanolamine, 8 parts of organic solvent, 6 parts of additives and 60 parts of ionized water;

[0048] The auxiliary agent is composed of the following raw materials in parts by weight: 5 parts of surfactant, 5 parts of film-forming agent, 3.5 parts of stabilizer and 0.8 part of thixotropic agent.

[0049] Wherein, the particle size of the nano-silver is 50nm.

[0050] Wherein, the organic solvent is one or a mixture of two or more of ethanol, propanol, butanol, vinyl acetate and butyl acetate.

[0051]Wherein, the surfactant is sodium dodecylbenzenesulfonat...

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Abstract

The invention discloses a soldering flux for a circuit board patch. The soldering flux comprises, by weight, 60-80 parts of rosin modified phenolic resin, 30-40 parts of rosin glyceride, 20-30 parts of succinic acid, 10-30 parts of dodecanol ester, 10-20 parts of acrylate, 5-15 parts of benzotriazole, 3-8 parts of benzimidazole, 5-10 parts of acrylonitrile, 2-8 parts of nano-silver, 5-10 parts of phenyl glycidyl ether, 8-15 parts of triethanolamine, 3-8 parts of organic solvents, 2-6 parts of auxiliaries and 40-60 parts of deionized water. The invention provides the soldering flux with good welding performance for the circuit board patch. The soldering flux is high in wettability to solder, can enhance the weldability of the solder, can adapt to the welding temperature of various kinds of solder, has no corrosion effect on solder alloy, has few residues after being welded, is high in insulation resistance, does not need to be cleaned, and is an ideal cleaning-free soldering flux for the solder.

Description

technical field [0001] The invention relates to the technical field of electronic welding, in particular to a soldering flux for patching a circuit board and a preparation method thereof. Background technique [0002] In recent years, with the increasingly high-speed development of electronic products, the application of surface mount technology is more extensive, because this technology allows size reduction, high density, high performance and low cost. However, traditional solder paste products are composed of tin-lead solder powder and flux. After the PCB is soldered, the heavy metal lead in the solder paste will be scattered in the environment with the discarded electronic products in the future. After long-term corrosion by acid rain, the lead will seep into the ground , Dissolved into the groundwater system, long-term accumulation in the body of humans or animals after drinking will cause heavy lead poisoning, endangering the health of humans and animals. Just because ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/40
CPCB23K35/3613B23K35/40
Inventor 李丹丹
Owner HEFEI TONGYOU ELECTRONICS TECH CO LTD
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