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Silver-coated copper powder and method for manufacturing same

A technology of silver-coated copper powder and manufacturing method, which is applied in the directions of coating, conductor, transportation and packaging, etc., can solve the problems of storage stability (poor reliability, high cost, etc.), and achieve the effect of excellent reliability and improved conversion efficiency

Active Publication Date: 2017-09-26
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, although silver powder has an extremely small volume resistivity and is a good conductive substance, it is expensive because it is a powder of a noble metal.
On the other hand, although copper powder has a low volume resistivity and is a good conductive substance, it is easily oxidized, so it has poor storage stability (reliability) compared with silver powder.

Method used

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  • Silver-coated copper powder and method for manufacturing same
  • Silver-coated copper powder and method for manufacturing same
  • Silver-coated copper powder and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Prepare a commercially available copper powder manufactured by the atomization method (atomized copper powder SF-Cu 5μm manufactured by Nippon Atomization Processing Co., Ltd. (Nippon Atmos Processing Co., Ltd.), and calculate the copper powder (before silver coating) Particle size distribution, the cumulative 10% particle size of copper powder (D 10 ) Is 2.26μm, 50% cumulative particle size (D 50 ) Is 5.20μm, 90% cumulative particle size (D 90 ) Is 9.32μm. In addition, the particle size distribution of the copper powder was measured with a laser diffraction particle size distribution device (MICROTRAC particle size distribution measuring device MT-3300 manufactured by Nikkiso Co., Ltd.), and the cumulative 10% particle size (D 10 ), cumulative 50% particle size (D 50 ), cumulative 90% particle size (D 90 ).

[0049] In addition, the following solution was prepared: a solution obtained by dissolving 1470g EDTA-4Na (43%) and 1820g ammonium carbonate in 2882g pure water (solu...

Embodiment 2

[0055] As the silver supporting liquid, in addition to using 1.67g of 100g / L silver potassium cyanide (acid concentration 60g / L) mixed with 0.1g tripotassium citrate monohydrate, 0.082g citric anhydride, 0.017gL-aspartic Except for the aqueous solution obtained by the acid and 2 g of water, by the same method as in Example 1, a silver-coated copper powder with silver supported on the surface was obtained. In addition, the concentrations of Ag and Cu in the filtrate were measured with an ICP mass analyzer (ICP-MS), and the results were 2 mg / L and 180 mg / L, respectively.

[0056] The Ag content in the thus-obtained silver-coated copper powder (supporting silver on the surface) was calculated by the same method as in Example 1. As a result, it was 10.84% ​​by mass. In addition, the amount of silver supported on the surface was calculated by the same method as in Example 1. As a result, it was 0.64% by mass.

[0057] In addition, the weight increase rate of the silver-coated copper po...

Embodiment 3

[0059] As the silver supporting liquid, except that 0.2 mL of the silver supporting liquid taken from 1 g of an aqueous solution containing 100 g / L of silver potassium cyanide was used, the same method as in Example 1 was used to obtain a silver supporting liquid on the surface. Coated with silver copper powder. In addition, the concentrations of Ag and Cu in the filtrate were measured with an ICP mass spectrometer (ICP-MS), and the results were less than 1 mg / L and 44 mg / L, respectively.

[0060] The Ag content in the thus-obtained silver-coated copper powder (supporting silver on the surface) was calculated by the same method as in Example 1. As a result, it was 10.50% by mass. In addition, the amount of silver supported on the surface was calculated by the same method as in Example 1. As a result, it was 0.30% by mass.

[0061] In addition, the weight increase rate of the silver-coated copper powder (supporting silver on the surface) at 200°C, 250°C, 300°C, and 350°C was calcul...

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PUM

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Abstract

A silver-coated copper powder obtained by coating the surfaces of a copper powder, obtained by an atomization process or the like, with a silver-containing layer comprising 5 mass% (with respect to the silver-coated copper powder) of silver or a silver compound is added to a silver support liquid comprising a silver potassium cyanide solution (or a silver potassium cyanide solution to which is added at least one or more compounds selected from the group consisting of potassium pyrophosphate, boric acid, potassium citrate monohydrate, anhydrous citric acid, and L-aspartic acid), and 0.01 mass% or more of silver (with respect to the silver-coated copper powder) is supported on the surfaces of the copper powder coated with the silver-containing layer.

Description

Technical field [0001] The present invention relates to silver-coated copper powder and a manufacturing method thereof, in particular to a silver-coated copper powder used in conductive paste and the like and a manufacturing method thereof. Background technique [0002] Conventionally, in order to form electrodes and wirings of electronic components by a printing method or the like, a conductive paste prepared by blending a solvent, resin, dispersant, etc., with conductive metal powder such as silver powder or copper powder has been used. [0003] However, although silver powder has extremely low volume resistivity and is a good conductive substance, it is expensive because it is a powder of noble metal. On the other hand, copper powder has a low volume resistivity and is a good conductive substance, but because it is easily oxidized, it has poor storage stability (reliability) compared to silver powder. [0004] In order to solve these problems, as the metal powder used for the con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F1/00H01B1/00H01B1/02H01B1/22H01L31/0224B22F1/17
CPCH05K1/092H05K2201/0218H01L31/022425H01B1/02H01B1/22Y02E10/50B22F1/17H01B1/026H01L31/18B22F2301/255B22F2301/10H01L31/0224
Inventor 野上德昭神贺洋
Owner DOWA ELECTRONICS MATERIALS CO LTD
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