Halogen-free thermosetting resin composition, prepreg using composition, and laminated plate for printed circuit
A resin composition, thermosetting technology, applied in the direction of printed circuits, synthetic resin layered products, layered products, etc., can solve the difficulty in meeting the requirements of dielectric properties, deterioration of the dielectric properties of cured products, phosphonate molecular weight restrictions, etc. problems, to achieve the effect of high molecular structure symmetry, uniform and non-dense phosphorus distribution, and reduce water absorption
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[0031] The present invention adopts the following technical scheme: a halogen-free thermosetting resin composition, which contains the following four substances as essential components, and the organic solids are calculated by 100 parts by weight, which includes:
[0032] (A) 16-42 parts by weight of halogen-free epoxy resin;
[0033] (B) 1.5-4.8 parts by weight of a compound having a dihydrobenzoxazine ring;
[0034] (C) 10-28 parts by weight of a phosphorus-containing bisphenol curing agent, the weight-average molecular weight of the phosphorus-containing bisphenol is 1000-6500;
[0035] (D) 30-70 parts by weight of silicon dioxide.
[0036] Each component is described in detail below.
[0037] Component (A) in the present invention, that is, halogen-free epoxy resin, is used in an amount of 16-42 parts by weight, such as 16 parts by weight, 18 parts by weight, 19 parts by weight, 20 parts by weight, 22 parts by weight, 23 parts b...
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