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A kind of flux and preparation method thereof

A flux and activator technology, applied in welding equipment, manufacturing tools, welding media, etc., can solve the problems of decreased surface insulation resistivity, residual printed component boards, and high ion pollution, achieving high insulation resistance, Less residue and reduced electromigration effects

Active Publication Date: 2019-04-23
湖南省东安夏力焊材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In consideration of the welding effect, some fluxes use highly corrosive substances with high solid content as active components, resulting in a lot of residual printed component boards after welding and are not easy to clean, with high ion pollution and low surface insulation resistivity. decline

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] This embodiment relates to a flux, which includes the following raw materials in parts by weight: 1 part of sodium cetyl sulfonate, 0.8 part of fatty amine polyoxyethylene ether, 12 parts of hydrazine hydroxycarboxylic acid compound, and 3 parts of ammonium chloride , 17 parts of modified rosin, 2 parts of activator, 0.5 part of surfactant, 0.6 part of film-forming agent, 2 parts of corrosion inhibitor, 0.6 part of antioxidant, 35 parts of deionized water.

[0028] Wherein, the modified rosin is hydrogenated rosin.

[0029] Wherein, the activator is a mixture of organic acid and organic amine, and the mass ratio of organic acid to organic amine is 7:1.

[0030] Wherein, the organic acid is selected from malic acid; the organic amine is alcohol amine, selected from diethanolamine.

[0031] Wherein, the corrosion inhibitor is a mixture of benzotriazole and imidazole.

[0032] A method for preparing the flux includes the following steps:

[0033] (1) Weigh out sodium cetyl sulfonate...

Embodiment 2

[0040] This embodiment relates to a flux, which includes the following raw materials in parts by weight: 2 parts of sodium cetyl sulfonate, 1.7 parts of fatty amine polyoxyethylene ether, 18 parts of hydrazine hydroxycarboxylic acid compounds, and 5 parts of ammonium chloride , 26 parts of modified rosin, 4 parts of activator, 1.5 parts of surfactant, 1.3 parts of film-forming agent, 3 parts of corrosion inhibitor, 1 part of antioxidant, 65 parts of deionized water.

[0041] Wherein, the modified rosin is polymerized rosin.

[0042] Wherein, the activator is a mixture of organic acid and organic amine, and the mass ratio of organic acid to organic amine is 7:1.

[0043] Wherein, the organic acid is citric acid; the organic amine is alcohol amine, selected from triethanolamine.

[0044] Wherein, the corrosion inhibitor is a mixture of 2-ethylimidazole and 2-mercaptobenzothiazole.

[0045] A method for preparing the flux includes the following steps:

[0046] (1) Weigh out sodium cetyl su...

Embodiment 3

[0053] This embodiment relates to a flux, which includes the following raw materials in parts by weight: 1.3 parts of sodium cetyl sulfonate, 1.1 parts of fatty amine polyoxyethylene ether, 14 parts of hydrazine hydroxycarboxylic acid compounds, and 3.5 parts of ammonium chloride , 20 parts of modified rosin, 2.3 parts of activator, 0.7 parts of surfactant, 0.9 parts of film forming agent, 2.3 parts of corrosion inhibitor, 0.7 parts of antioxidant, and 40 parts of deionized water.

[0054] Wherein, the modified rosin is a mixture of disproportionated rosin, maleic rosin and rosin ester.

[0055] Wherein, the activator is a mixture of organic acid and organic amine, and the mass ratio of organic acid to organic amine is 7:1.

[0056] Wherein, the organic acid is a mixture of succinic acid and glutaric acid; the organic amine is an alcohol amine, selected from diethanolamine.

[0057] Wherein, the corrosion inhibitor is a mixture of benzotriazole, imidazole, and 2-ethylimidazole.

[0058...

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Abstract

The invention discloses a novel soldering flux which is prepared from the following raw materials in parts by weight: 1 to 2 parts of hexadecylsulfonic acid, 0.8 to 1.7 parts of fatty amine polyoxyethylene ether, 12 to 18 parts of a hydrazine hydroxycarboxylic acid compound, 3 to 5 parts of ammonia chloride, 17 to 26 parts of modified rosin, 2 to 4 parts of an activator, 0.5 to 1.5 parts of a surfactant, 0.6 to 1.3 parts of a film forming agent, 2 to 3 parts of a corrosion inhibitor, 0.6 to 1 part of an anti-oxidization agent and 35 to 65 parts of deionized water. According to the novel soldering flux, the deionized water is used as a solvent, so that the production cost is reduced, and the aims of environmental protection, stabilization and safety are fulfilled; and the novel soldering flux is high in adaptability to lead-free welding. Due to the relatively low solid content, a few of residues are retained after the novel soldering flux assists in soldering; the novel soldering flux is high in insulation resistance and meets the no-cleaning requirement.

Description

Technical field [0001] The invention belongs to the technical field of welding, and specifically relates to a flux and a preparation method thereof. Background technique [0002] Traditional electronic products use lead-tin solder as the soldering material. Lead-tin solder has a low melting point (183°C) and good solderability. However, with the promulgation and implementation of the lead ban on electronic information products, the use of lead-tin solder has been restricted, and lead-free solder has gradually replaced lead-tin solder as an important connection material in the electronics industry. However, due to the high melting point of lead-free solder, it is easy to oxidize during use, and has poor wettability. Traditional flux can no longer meet the soldering requirements of lead-free solder. [0003] At present, most of the fluxes that are widely used are organic solvent fluxes. The active ingredients of this type of flux must be dissolved in organic solvents, which have dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/36B23K35/40
CPCB23K35/3612B23K35/40
Inventor 殷世尧
Owner 湖南省东安夏力焊材有限公司
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