Low-resistance electric conduction adhesive

Abstract

The present invention relates to a low-resistance electric conduction adhesive, which comprises, by weight, 10-20 parts of polyacrylate, 20-30 parts of boron nitride, 20-30 parts of zinc oxide, 10-15 parts of an electric conduction filler, 15-20 parts of silver powder, and 10-18 parts of polydimethylsiloxane. The low-resistance electric conduction adhesive of the present invention has advantages of good electrical conductivity, strong bonding ability, wear resistance, high-temperature resistance, good stability, no toxicity, and environmental protection.

Description

technical field [0001] The invention relates to the field of interface heat dissipation materials, in particular to a low-resistance conductive glue. Background technique [0002] With the increasing integration density of microelectronic devices, the heat dissipation requirements of microelectronic devices are also increasing. Therefore, it is of great significance to develop an interface heat dissipation material with high conductivity. Due to its environmental friendliness and low cost, conductive adhesives have gradually replaced traditional tin-lead solder interconnect materials. However, the development of traditional conductive adhesives also encountered some bottlenecks, such as low conductivity, high density, and low stability. Contents of the invention [0003] The technical scheme adopted by the present invention to solve its technical problems is: provide a kind of low-resistance conductive glue, it is characterized in that: comprise polyacrylate, boron nitrid...

AI Technical Summary

Problems solved by technology

However, the development of traditional conductive adhesives also encountered some bottlenecks, such as low conductivity, high density, and low stability.