Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Oxygen-enriched top-blown copper smelting combined with a method for treating waste printed circuit boards

An oxygen-enriched top-blowing and waste printing technology, which is applied in the field of oxygen-enriched top-blowing copper smelting and processing of waste printed circuit boards, can solve the problems of high energy consumption, strict requirements on raw material particle size, composition, process conditions, and complex pretreatment process. , to achieve the effect of high reaction temperature, strong adaptability of raw materials, and inhibition of dioxin formation

Active Publication Date: 2018-07-17
CENT SOUTH UNIV +1
View PDF9 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process is simple and the processing capacity is large, but it has strict requirements on the particle size, composition and process conditions of raw materials, and the pretreatment process is complex and energy-consuming.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Oxygen-enriched top-blown copper smelting combined with a method for treating waste printed circuit boards
  • Oxygen-enriched top-blown copper smelting combined with a method for treating waste printed circuit boards
  • Oxygen-enriched top-blown copper smelting combined with a method for treating waste printed circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0040] Referring to the accompanying drawings, the method for oxygen-enriched top-blown copper smelting combined with processing waste printed circuit boards is as follows:

[0041] (1) Heating detinning treatment: heat the waste printed circuit board at 200°C to remove the solder, obtain solder, detinned substrate and electronic components, melt the solder and cast ingots, screen and separate the electronic components, and send the detinned substrate into step (2);

[0042] (2) Crushing treatment: coarsely crush the detinned substrate to 50mm×50mm with a crusher;

[0043] (3) Mixed smelting: send the crushed detinned substrate and electronic components to the furnace top feeding port 3 at a rate of 6 t / h with a belt conveyor, and continuously and evenly feed them into the oxygen-enriched top-blown furnace 1;

[0044] Using high-silicon river sand and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
Login to View More

Abstract

The invention provides a method for treating waste printed circuit boards with combination of oxygen-enriched top-blown copper smelting. The method comprises the following steps: (1) heating and removing tin; (2) crushing; (3) mixing and smelting; (4) treating melts; (5) treating smoke in a furnace; and (6) treating the smoke out of the furnace. According to the method, copper concentrates are used as the main raw materials and cooperate with part of waste printed circuit boards; the treatment of the waste circuit boards is combined with oxygen-enriched top-blown copper smelting; organic matters are effectively decomposed in a high-temperature smelting tank; the organic matters and sulphide ore are oxidized to generate heat and achieve self-heating smelting; high-concentration SO2 smoke is used for inhibiting generation of dioxin; secondary air is blown for decomposing residual compounds; the smoke enters an acid production system after being subjected to waste heat recovery, electric dust collection and water-injection cooling. The method is low in energy consumption and high in comprehensive recovery rate of valuable metals, is capable of recycling the waste circuit boards and can solve the problems of serious pollution, generation of hypertoxic dioxin and low metal recovery rate of the existing waste circuit board treatment process.

Description

technical field [0001] The invention belongs to the field of fire treatment of waste printed circuit boards, and in particular relates to a method for treating waste printed circuit boards with oxygen-enriched top-blown copper smelting and matching. Background technique [0002] Waste printed circuit boards are mainly composed of electronic components, organic reinforced resin, glass fiber, copper foil, etc., of which the metal content generally exceeds 40%, mainly including common metals Cu, Fe, Ni, Zn and precious metals Au, Ag, Pt, Pd A large amount of recyclable materials such as cellulose, etc., have high economic value. On the other hand, waste printed circuit boards generally contain lead, cadmium, mercury and other substances that are harmful to the human body and the environment. Brominated flame retardants, phenolic resins, epoxy resins, etc. in organic components are not effectively treated. A large number of highly toxic carcinogens. It can be seen from this th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22B7/00C22B15/06
CPCC22B7/004C22B15/0028
Inventor 郭学益田苗王亲猛田庆华李栋
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com