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Modified epoxy resin and glass fiber reinforcement plate prepared based on same

An epoxy resin, glass fiber technology, applied in glass/slag layered products, layered products, chemical instruments and methods, etc., can solve the problem that the toughness and high temperature resistance cannot be improved at the same time, and the low temperature resistance limits the use of products, The problem of single-targeted modifiers can achieve the effects of good adhesion, excellent comprehensive performance, and improved heat resistance and toughness.

Active Publication Date: 2017-08-11
广东省创埠实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin molding process has various performances, but the crosslinking density after curing is high, resulting in high internal stress of the cured product, resulting in high brittleness of the product, and low high temperature resistance, which limits the use of the product
At present, the methods to improve the toughness and heat resistance of epoxy resin mainly include adding various modifiers, but the pertinence of modifiers is relatively single, and often can only improve its toughness or high temperature resistance, but cannot improve its toughness and high temperature resistance at the same time

Method used

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  • Modified epoxy resin and glass fiber reinforcement plate prepared based on same
  • Modified epoxy resin and glass fiber reinforcement plate prepared based on same
  • Modified epoxy resin and glass fiber reinforcement plate prepared based on same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Prepare modified epoxy resin, the steps are as follows:

[0030] 1) Mix 4g of dimethyldiethoxysilane and 100g of CYD-127 epoxy resin (viscosity at room temperature: 350mPa·s, gel time: 20min), heat up to 80°C, add 0.5g of dibutyltin dilaurate and 1g of distilled water, then continue to heat up to 95°C, keep warm for 5.5h to make the chemical mixing reaction between dimethyldiethoxysilane and epoxy resin fully occur, at this time the reaction liquid changes from clear to milky white, indicating that the reaction is complete, and it is removed by vacuum distillation By-products obtain silicone-modified epoxy resins;

[0031] 2) Melt 5g of diphenylmethane bismaleimide and 5.53g of 4,4'-diaminodiphenylmethane in an oil bath at 135-140°C in advance to cause Michael addition reaction to occur, and stop heating after 5 minutes of reaction Cool down to 95-100°C, add the obtained silicone-modified epoxy resin, mix thoroughly in an oil bath at 135-140°C, stir evenly, stop heatin...

Embodiment 2

[0035] Preparation of glass fiber reinforced laminates, the steps are as follows:

[0036] 1) Mix 4g of dimethyldiethoxysilane and 100g of CYD-127 epoxy resin (viscosity at room temperature: 380mPa·s, gel time: 24min), heat up to 80°C, add 0.5g of dibutyltin dilaurate and 1g of distilled water, then continue to heat up to 90°C, keep warm for 5.5h to make the chemical mixing reaction of dimethyldiethoxysilane and epoxy resin fully occur. By-products obtain silicone-modified epoxy resins;

[0037] 2) Melt 5g of diphenylmethane bismaleimide and 5.53g of 4,4'-diaminodiphenylmethane in an oil bath at 135-140°C in advance to cause Michael addition reaction, stop heating after 5 minutes of reaction Cool down to 95-100°C, add the silicone-modified epoxy resin obtained in step 1), mix thoroughly in an oil bath at 135-140°C, stir evenly, stop heating and wait until it cools to room temperature, then add 28g of 4,4'- Diaminodiphenylmethane, vacuum defoaming and stirring evenly to obtai...

Embodiment 3

[0041] Preparation of glass fiber reinforced laminates, the steps are as follows:

[0042] 1) Mix 4g of dimethyldiethoxysilane and 100g of CYD-127 epoxy resin (viscosity at room temperature: 400mPa·s, gel time: 30min), heat up to 80°C, add 0.5g of dibutyltin dilaurate and 1g of distilled water, then continue to heat up to 95°C, and keep warm for 5 hours to fully chemically mix the dimethyldiethoxysilane and epoxy resin. At this time, the reaction solution changes from clear to milky white, indicating that the reaction is complete. The product obtains the epoxy resin modified by organosilicon;

[0043] 2) Melt 10g of diphenylmethane bismaleimide and 11.3g of 4,4'-diaminodiphenylmethane in an oil bath at 135-140°C in advance to cause Michael addition reaction to occur, and stop heating after 5 minutes of reaction Cool down to 95-100°C, add the obtained silicone-modified epoxy resin, mix thoroughly in an oil bath at 135-140°C, stir evenly, stop heating and add 23g of 4,4'-diamin...

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Abstract

The invention relates to modified epoxy resin and a modified epoxy resin / glass fiber reinforcement plate prepared based on a resin system. The modified epoxy resin is prepared from, by weight, 100 parts of CYD-127 epoxy resin, 5-18 parts of 4,4'-diaminodiphenylmethane (I), 5-15 parts of diphenylmethane bismaleimide, 4 parts of diethoxydimethylsilane, 0.5 part of dibutyltin dilaurate, 1 parts of distilled water and 18-28 parts of 4,4'-diaminodiphenylmethane (II). The curing temperature of the modified epoxy resin is 80-230 DEG C, the thermal decomposition temperature of the modified epoxy resin layer press plate reaches 359-370 DEG C in the aspect of heat resistance, the impact intensity reaches 45.57-59.65 KJ / m<2> in the aspect of impact strength, the bending strength reaches 270-295 DEG C, and good tenacity and heat resistance are achieved.

Description

technical field [0001] The invention belongs to the technical field of polymer-based composite materials, and relates to a modified epoxy resin and [0002] The modified epoxy resin / glass fiber reinforced board prepared by the resin system. Background technique [0003] Epoxy resin has excellent physical and mechanical properties and electrical properties, and is widely used in electrical insulation materials, adhesives, anti-corrosion materials and other fields. Due to the rapid development of the electronics and electrical appliances industry, and the rapid technological update, the epoxy resin materials supporting it are facing the problem of high performance. An important direction for the high performance of epoxy resins is to improve the heat resistance and toughness of cured resins. Epoxy resin molding process has various performances, but the crosslinking density after curing is high, resulting in high internal stress of the cured product, resulting in high brittle...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/20C08G59/14C08L63/00C08K7/14B32B17/04B32B17/12
CPCB32B5/02B32B5/26B32B2260/023B32B2260/046B32B2262/101B32B2307/206B32B2307/306B32B2307/558C08G59/1438C08G59/1477C08G59/1494C08G59/20C08G59/5033C08K7/14C08L2201/08C08L63/00
Inventor 曾黎明艾吉祥
Owner 广东省创埠实业有限公司
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