Manufacture method for subsided high-density mutual connection board

Abstract

A manufacture method for a subsided high-density mutual connection board includes steps of manufacturing an inner layer soft board; manufacturing conducting copper posts in conduction with an outer layer rigid board by utilizing an addition process on the upper side and the lower side of the inner layer soft board or on one side of the inner layer soft board and performing electroplating on the conducting copper posts; filling an insulation bonding layer bonded with the outer layer rigid board on the upper side and the lower side of the inner layer soft board or on the same side of the inner layer soft board and grinding the surface of the insulation bonding layer so as to expose the conducting copper posts; manufacturing an outer layer rigid board circuit by adopting an addition process electroplating technology on the insulation bonding layer; performing hollowing processing on a subsided region; and performing steel board reinforcement processing on the bottom part of the subsided region. According to the invention, the conducting copper posts manufactured through addition electroplating are adopted to replace traditional drilling holes and laser drilling holes for conduction; the minimum diameter of each conducting copper post can be as small as 0.05 mm; wiring can be performed on the conducting posts and the minimum wire width\wire space of the circuit manufactured by using the addition process can be 15\15 micrometers. Therefore, circuit fineness is improved and wiring density is improved substantially. The invention also has characteristics of simple manufacture process and low cost and area available for wiring is enlarged.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing a sunken high-density interconnection board. Background technique [0002] With the continuous advancement of technology, the functional requirements of electronic products are getting higher and higher. At the same time, the appearance is also very short, small, light and thin. For this reason, more and more circuit boards with multi-layer integrated functions are used, especially It is the high-density interconnection board that has developed rapidly in recent years. High-density interconnection board is a high-precision, thin-line, small-aperture, ultra-thin printed board. It introduces blind buried holes in conventional circuit boards, fine line width and line spacing, and can manufacture conventional multi-layer board technology. Thin, multi-layer, stable circuit boards that cannot be achieved, which have the following ...

AI Technical Summary

Problems solved by technology

This kind of soft-rigid circuit board is prepared by metal welding and interconnection. Metal welding columns are used to replace the original mechanical drilling or laser drilling. The minimum diameter can be 0.05mm, which increases the area where the design can be routed, but The production of the outer layer circuit adopts the ordinary etching (subtraction) process, and the ordinary etching (subtraction) process makes the circuit: the minimum line width is about 50\50um, and the thicker the copper thickness, the harder it is to etch the line, and the larger the etched burrs, When the copper thickness exceeds 20um, the line width of 50\50um cannot be etched

Therefore, the method of metal welding and interconnection is not ideal in terms of fine line production, so the production process needs to be improved and optimized.

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