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Surface conductive gold platinum palladium paste applied to low-temperature co-fired ceramic and preparation method thereof

A low-temperature co-fired ceramic, platinum and palladium technology, which is used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Problems such as poor solderability of paste and poor matching of film and tape co-firing to achieve reliable performance, good solderability and good printability

Inactive Publication Date: 2017-07-07
上海晶材新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing conductive gold platinum palladium paste and LTCC low dielectric constant microwave dielectric materials are not satisfactory in terms of matching, printing, bonding strength or conductivity
Among them, the schematic diagram of surface conductor gold platinum palladium paste is as follows figure 1 Shown, generally speaking, comprise film tape 10, and be printed on the conductor gold platinum palladium paste 20 on this film tape surface, yet, the solderability of common conductor gold platinum palladium paste is poor, film tape and gold platinum palladium paste Co-firing materials have poor matching and cannot fully meet the needs of the application

Method used

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  • Surface conductive gold platinum palladium paste applied to low-temperature co-fired ceramic and preparation method thereof
  • Surface conductive gold platinum palladium paste applied to low-temperature co-fired ceramic and preparation method thereof

Examples

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Embodiment 1

[0032] This embodiment provides a surface conductive gold-platinum-palladium paste applied to low-temperature co-fired ceramics. The surface conductive gold-platinum-palladium paste includes the following components in terms of mass ratio: 35% gold particles, 20% platinum particles, 10% palladium particles, 10% inorganic additives, 20% carrier, 0.5% auxiliary, and 4.5% solvent.

[0033] As an example, the shape of the gold particles is spherical, and the particle size is selected from gold powder whose D50 is between 1-3 microns and whose D90 is not greater than 5 microns. The shape of the platinum particles is spherical; the particle size is selected from the platinum powder whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns. The shape of the palladium particles is spherical; the particle size is selected from the palladium powder whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns. As an example, the inorganic addit...

Embodiment 2

[0043] This embodiment provides a surface-conductive gold-platinum-palladium paste applied to low-temperature co-fired ceramics. The surface-conductive gold-platinum-palladium paste includes the following components in terms of mass ratio: 51% gold particles, 20% platinum particles, 20% palladium particles, 1% inorganic additives, 5% carrier, 0.3% auxiliary, and 2.7% solvent.

[0044] As an example, the shape of the gold particles is sheet-like, and the particle size is selected from gold powders whose D50 is between 1-3 microns and whose D90 is not greater than 5 microns. The appearance of the platinum particles is sheet-like; the particle size is selected from platinum powder whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns. The shape of the palladium particles is flaky; the particle size is selected from the palladium powder whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns.

[0045] As an example, the inorgani...

Embodiment 3

[0054] This embodiment provides a surface-conductive gold-platinum-palladium paste applied to low-temperature co-fired ceramics. The surface-conductive gold-platinum-palladium paste includes the following components in terms of mass ratio: 51% gold particles, 20% platinum particles, 20% palladium particles, 1% inorganic additives, 5% carrier, 1% auxiliary, and 2% solvent.

[0055] As an example, the size of the gold particles is selected from gold powders whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns.

[0056] As an example, the size of the platinum particles is selected from gold powder with a D50 between 1-3 microns and a D90 not greater than 5 microns, and the shape is 50 parts in flake shape and 50 parts in spherical shape.

[0057] As an example, the size of the palladium particles is selected from gold powder with a D50 between 1-3 microns and a D90 not greater than 5 microns, and the shape is 50 parts in flake shape and 50 parts in sph...

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Abstract

The invention provides a surface conductive gold platinum palladium paste applied to low-temperature co-fired ceramic and a preparation method thereof. The surface conductive gold platinum palladium paste comprises the following components in percentage by mass: 35%-80% of gold particles, 1%-30% of platinum particles, 1%-30% of palladium particles, 0%-10% of an inorganic matter additive, 5%-25% of a carrier, 0.3%-1% of an auxiliary agent and 0.5%-5% of a solvent. The surface conductive gold platinum palladium paste has the advantages of good co-firing matching property with membrane zones of systems such as CaO-B2O3-SiO2 with reliable performance in a high-frequency condition, good printing property, excellent conductive performance and good weldability. The preparation method provided by the invention is simple in step and easy to realize industrialization.

Description

technical field [0001] The invention relates to a conductive paste and a preparation method thereof, in particular to a surface conductive gold-platinum-palladium paste applied to low-temperature co-fired ceramics and a preparation method thereof. Background technique [0002] With the rapid development of modern information technology, there are demands for miniaturization, convenience, multi-function and high reliability of electronic products. Low temperature co-fired ceramic (LTCC) technology is a new technology emerging in recent years. The eye-catching multidisciplinary integrated component technology has become the first choice for the integration and modularization of electronic components in the future because of its excellent electronic and thermomechanical properties. The high frequency of LTCC low dielectric constant microwave dielectric materials is an inevitable trend in the development of microwave components, and low dielectric constant and low loss are the d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 兰开东
Owner 上海晶材新材料科技有限公司
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