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A transitional hole filling paste used for connecting the upper and lower gold and silver layers of the film in the LTCC substrate

A technology for connecting films and substrates, which is applied in the field of transitional hole-filling pastes, can solve problems such as migration, achieve good electrical conductivity, improve sintering density, and good electrical conductivity

Active Publication Date: 2022-03-29
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of silver ion migration in the transitional hole-filling slurry, the present invention provides a transitional hole-filling slurry using titanium nitride (TiN) powder, which can be prepared between LTCC substrates Dense metal layer, good durability and good electrical conductivity transition hole filling layer

Method used

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  • A transitional hole filling paste used for connecting the upper and lower gold and silver layers of the film in the LTCC substrate
  • A transitional hole filling paste used for connecting the upper and lower gold and silver layers of the film in the LTCC substrate
  • A transitional hole filling paste used for connecting the upper and lower gold and silver layers of the film in the LTCC substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Weigh 8g of gold powder, 70g of silver powder, 2g of platinum powder, 5g of Ca-B-Si glass powder, 10g of TiN powder, and 5g of organic carrier, stir evenly with a glass rod, and place it for more than 1 hour to complete infiltration, and then roll on a three-roller machine , so that the fineness ≦ 15μm, to obtain transitional hole filling slurry.

Embodiment 2

[0026] Weigh 12.5g of gold powder, 63.5g of silver powder, 7g of platinum powder, 3g of Ca-B-Si glass powder, 9g of TiN powder, and 5g of organic carrier, stir evenly with a glass rod, and place it for more than 1 hour to complete infiltration, and then put it on a three-roll machine Rolling to make the fineness≦15μm, to obtain transitional hole filling slurry.

Embodiment 3

[0028] Weigh 12.5g of gold powder, 63.5g of silver powder, 7g of platinum powder, 3g of Ca-B-Si glass powder, 4g of TiN powder, and 10g of organic carrier, stir evenly with a glass rod, and place it for more than 1 hour to complete infiltration, and then put it on a three-roller machine Rolling to make the fineness≦15μm, to obtain transitional hole filling slurry.

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Abstract

The invention discloses a transition hole-filling slurry used for connecting the upper and lower gold and silver layers of a film belt in an LTCC substrate. In terms of mass percentage, the transition hole-filling slurry consists of 8%-13% gold powder, 60%-70% Silver powder, 2%~7% platinum powder, 3%~8% Ca-B-Si glass powder, 2%~10% TiN powder and 5%~15% organic vehicle. The hole-filling transition slurry of the invention has the advantages of good co-firing matching with the A6 film tape, good bonding with the upper and lower gold and silver layers, good hole-filling compactness, good electrical conductivity, and the like.

Description

technical field [0001] The invention belongs to the technical field of conductive paste, and in particular relates to a transition hole-filling paste applied to a connection film of a low-temperature co-fired ceramic (LTCC) substrate with upper and lower gold and silver film layers. Background technique [0002] With the wide application of electronic products, light, small and thin become the mainstream development trend, and the requirements for the performance of integrated circuits are getting higher and higher. Compared with traditional integrated circuits, integrated circuits made by LTCC technology have greatly improved integration and can Further reducing the size of electronic components while maintaining their original functions has broad application prospects. The connection and conduction of the circuit between the LTCC substrates plays a decisive role in the stable operation of the entire circuit. Therefore, the development of new products that match the LTCC s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/14H01B1/16H01B1/20H01B1/22H01L23/498
CPCH01B1/14H01B1/16H01B1/20H01B1/22H01L23/49883
Inventor 张建益王明奎杜彬张琳党丽萍张啸
Owner 西安宏星电子浆料科技股份有限公司
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