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A kind of hole filling conductive gold paste applied to low temperature co-fired ceramics and preparation method thereof

A low-temperature co-fired ceramic and hole-filling technology, which is used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of hole density and unsatisfactory conductivity. Achieve the effect of good filling density, excellent electrical conductivity and reliable performance

Active Publication Date: 2017-09-05
SHANGHAI LINEPRINTING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing conductive gold paste for hole filling and LTCC low dielectric constant microwave dielectric material are not satisfactory in terms of matching, hole filling compactness, and electrical conductivity.

Method used

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  • A kind of hole filling conductive gold paste applied to low temperature co-fired ceramics and preparation method thereof
  • A kind of hole filling conductive gold paste applied to low temperature co-fired ceramics and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] This embodiment provides a conductive gold paste for filling holes applied to low-temperature co-fired ceramics. The conductive gold paste for filling holes includes the following components in terms of mass ratio: 80% gold particles, 10% inorganic additives, 5% % carrier, 0.5% adjuvant, and 4.5% solvent.

[0030] As an example, the gold particles are selected from gold powders whose morphology is spherical and whose particle size is selected from gold powders whose D50 is between 1-3 microns and D90 is not greater than 5 microns.

[0031] As an example, the inorganic additives include the following components in parts by weight: 25 parts of Al 2 o 3 , 30 parts of SiO 2 , 10 copies of Bi 2 o 3 , 25 parts of CaCO 3 , and 10 parts of SrCaO 3 .

[0032] As an example, the carrier includes a mixture of the following components in mass ratio: 30% specialty resin, and 70% solvent. Further, the special resin is selected from esters, and the solvent is selected from alc...

Embodiment 2

[0041] This embodiment provides a conductive gold paste for filling holes applied to low-temperature co-fired ceramics. The conductive gold paste for filling holes includes the following components in terms of mass ratio: 95% gold particles, 1% inorganic additives, 1% % carrier, 0.3% adjuvant, and 2.7% solvent.

[0042] As an example, the gold particles are selected from gold powders whose morphology is flake-like, and whose particle size is selected from gold powder whose D50 is between 1-3 microns and whose D90 is not greater than 5 microns.

[0043] As an example, the inorganic additives include the following components in parts by weight: 20 parts of Al 2 o 3 , 35 parts of SiO 2, 10 copies of Bi 2 o 3 , 20 parts of CaCO 3 , and 15 parts of SrCaO 3 .

[0044] As an example, the carrier includes a mixture of the following components in mass ratio: 10% specialty resin, and 90% solvent. Further, the special resin is selected from alcohol esters, and the solvent is sele...

Embodiment 3

[0052] This embodiment provides a conductive gold paste for filling holes applied to low-temperature co-fired ceramics. The conductive gold paste for filling holes includes the following components in terms of mass ratio: 85% gold particles, 5% inorganic additives, 6 % carrier, 1% adjuvant, and 3% solvent.

[0053] As an example, the size of the gold particles is selected from gold powders whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns.

[0054] As an example, the inorganic additives include the following components in parts by weight: 40 parts of Al 2 o 3 , 15 parts of SiO 2 , 35 copies of Bi 2 o 3 , 5 parts of CaCO 3 , and 5 parts of SrCaO 3 .

[0055] As an example, the carrier includes a mixture of the following components in mass ratio: 20% specialty resin, and 80% solvent. Further, the special resin is cellulose, and the solvent is alcohol.

[0056] As an example, the main and auxiliary components include a silane coupling agent...

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Abstract

The invention provides a hole-filling conductive gold paste applied to low-temperature co-fired ceramics and a preparation method thereof. The hole-filling conductive gold paste includes the following components in terms of mass ratio: 80% to 95% of gold particles, 0% ~10% inorganic additives, 1%~15% carrier, 0.3~1% additives, and 0.5%~5% solvent. The hole-filling conductive gold paste of the present invention has the advantages of good co-firing compatibility with "CaO-B2O3-SiO2" and other system film tapes with reliable performance under high-frequency conditions, good hole-filling compactness, and excellent electrical conductivity. The method of the invention has simple steps and is easy to realize industrialization.

Description

technical field [0001] The invention relates to a conductive paste and a preparation method thereof, in particular to a hole-filling conductive gold paste applied to low-temperature co-fired ceramics and a preparation method thereof. Background technique [0002] With the rapid development of modern information technology, there are demands for miniaturization, convenience, multi-function and high reliability of electronic products. Low temperature co-fired ceramic (LTCC) technology is a new technology emerging in recent years. The eye-catching multidisciplinary integrated component technology has become the first choice for the integration and modularization of electronic components in the future because of its excellent electronic and thermomechanical properties. The high frequency of LTCC low dielectric constant microwave dielectric materials is an inevitable trend in the development of microwave components, and low dielectric constant and low loss are the design basis of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00
Inventor 汪九山兰开东杨兆国
Owner SHANGHAI LINEPRINTING MATERIALS CO LTD
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