A trench gate enhanced mis structure algan/gan heterojunction field effect transistor

A technology of heterojunction field effect and MIS structure, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of threshold voltage and output current reduction, device avalanche breakdown, reliability reduction, etc., and achieve breakdown voltage Improvement, increase in peak electric field drop, and easy production effects

Active Publication Date: 2020-08-21
XIDIAN UNIV
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Problems solved by technology

[0008] In order to solve the device avalanche breakdown and current collapse effect caused by the peak electric field at the gate edge of the AlGaN / GaN heterojunction field effect transistor with a trench-gate enhanced MIS structure in the prior art, the threshold voltage and output current are reduced, and the reliability To solve a series of problems such as low performance, the present invention provides a novel trench gate enhanced MIS structure AlGaN / GaN heterojunction field effect transistor

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  • A trench gate enhanced mis structure algan/gan heterojunction field effect transistor
  • A trench gate enhanced mis structure algan/gan heterojunction field effect transistor

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Embodiment Construction

[0036] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0037] This embodiment is a novel trench gate enhanced MIS structure AlGaN / GaN heterojunction field effect transistor with part of the intrinsic GaN cap layer. Its structure is as figure 1 As shown, it mainly includes: semi-insulating substrate 0; heteroepitaxially grown AlN nucleation layer 1 on the semi-insulating substrate; GaN buffer layer 2 epitaxially grown on the AlN nucleation layer; epitaxially grown on the GaN buffer layer AlGaN barrier layer 3; gate groove 4, drain 5 and source 6 on the AlGaN barrier layer; insulating dielectric layer 7 on the gate groove; gate 8 on the insulating dielectric layer; An intrinsic GaN cap layer 9 located on the AlGaN barrier layer and adjacent to the edge of the gate.

[0038] The trench gat...

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Abstract

The invention discloses a trench-gate enhanced type MIS structure AlGaN / GaN heterojunction field effect transistor which is provided with a part of intrinsic GaN cap layer. The novel structure of the field effect transistor is formed in a manner of introducing the intrinsic GaN cap layer to the edge of a transistor gate, wherein the intrinsic GaN cap layer will reduce the two-dimensional electron gas concentration of a regional conductive trench, and achieves the electric field modulation effect. Through a new electric field peak, the transistor reduces the high electric field of the gate edge, and enables the distribution of the electric field of the surface of the transistor to be more uniform. Compared with a conventional trench-gate enhanced type MIS structure, the novel structure greatly improves the breakdown voltage and reliability.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a trench gate enhanced MIS structure AlGaN / GaN heterojunction field effect transistor. Background technique [0002] Due to the limitations of the first-generation and second-generation semiconductor materials represented by Si and GaAs, the third-generation wide-bandgap semiconductor materials have been developed rapidly because of their excellent performance. As one of the cores of the third-generation semiconductor materials, GaN material is special in its polarization effect compared with Si, GaAs and SiC. Taking advantage of this particularity, people have developed AlGaN / GaN high electron mobility transistors, and AlGaN / GaN HEMTs are GaN-based microelectronic devices based on AlGaN / GaN heterojunction materials. AlGaN / GaN heterojunction forms a high-density two-dimensional electron gas (2DEG) at the heterojunction interface through spontaneous polarization and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/778H01L29/06
CPCH01L29/0607H01L29/7787
Inventor 段宝兴谢慎隆郭海君袁嵩杨银堂
Owner XIDIAN UNIV
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