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Printed circuit board processing method, system and copper foil for processing

A technology of printed circuit boards and processing methods, applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as endangering the health of workers, harming the health of operators, and inability to reuse them, and achieves a reduction in feces. The effect of avoiding the damage of toxic substances and reducing the production time

Active Publication Date: 2017-05-31
北京启创驿讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] ① Corrosion in corrosive liquids is very dangerous, and it is easy to cause harm to the body of the operator and endanger the health of the staff
[0006] ②The corroded copper foil is lost in the corrosion solution and cannot be reused, resulting in waste of raw materials
[0007] ③ A large amount of chemical waste water is produced, which has high treatment costs and great environmental hazards

Method used

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  • Printed circuit board processing method, system and copper foil for processing
  • Printed circuit board processing method, system and copper foil for processing

Examples

Experimental program
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Effect test

preparation example Construction

[0042] S5. Preparation of a printed circuit board, transferring the copper foil of the circuit part on the carrier to the substrate to obtain a printed circuit board. After the transfer is completed, use testing equipment to detect the circuit pattern of the printed circuit board on the substrate to ensure that the circuit pattern of the printed circuit board is correct.

[0043] Preferably, the selective viscosity treatment may specifically be to perform viscosity reduction treatment on the viscous substance between the copper foil corresponding to the non-circuit part and the carrier. In this embodiment, the physical viscosity treatment adopts water cooling treatment. The temperature of the water cooling treatment is 0-5 degrees. The water cooling treatment adopts a water cooling circulation device for cooling treatment, which includes a controller, a cooling circulation device and a water temperature sensor arranged inside the cooling circulation device. The cooling circula...

specific Embodiment 1

[0056] S1. Laser cutting: the copper foil pasted on the carrier is cut out of the required circuit by laser. Before laser cutting, the copper foil is first adhered to the carrier by means of an adhesive substance to obtain the copper foil to be cut.

[0057] S2. Perform selective viscosity treatment between the copper foil corresponding to the non-circuit part and the carrier. The viscosity between the copper foil corresponding to the non-circuit part and the carrier is different from the viscosity between the copper foil corresponding to the circuit part and the carrier, so as to facilitate the peeling of the copper foil of the non-circuit part.

[0058] S3. Selective adsorption: selectively adsorb the copper foil corresponding to the non-circuit part after cutting. The adsorption method can be electrostatic adsorption or negative pressure adsorption. The copper foil on the carrier corresponding to the non-circuit part is selectively adsorbed, so that it can be peeled off b...

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Abstract

The present invention provides a printed circuit board processing method, which includes the following steps: S1, laser cutting: using laser to cut out a circuit needed on the copper foil which is pasted on the carrier; S2, preferential viscosity processing: carrying out preferential viscosity processing to the copper foil and the carrier; S3, preferential adsorption: carrying out preferential adsorption to the cut copper foil corresponding to the non-circuit part; S4, peeling: peeling the non-circuit part of copper foil off the carrier to obtain the copper foil corresponding to the circuit part attached to the carrier; S5, preparation of the printed circuit board, transferring the copper foil of the circuit part on the carrier to the baseboard to obtain the printed circuit board. It is possible to use laser cutting to cut the printed circuit board, avoid chemical milling in the manufacture process, and directly recycle the waste copper, is of great value of environmental protection while reducing the cost, and a new thought for preparing printed circuit board with copper foil is provided.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a method and system for processing a printed circuit board and copper foil for processing. Background technique [0002] The layout of the printed circuit board needs to use copper foil to describe the circuit. Therefore, copper foil is widely used in the field of printed circuit board applications. , but now the mainstream is still the subtraction method, in which copper foil is used and excess parts are removed by etching to form circuits on circuit boards. [0003] For example, the invention patent with application number 2014103931912 provides a circuit board and its manufacturing method, and removes excess copper foil by uniformly etching away the copper foil layer in the etched area. [0004] The current etching method is mainly to place the copper foil on the substrate, coat and corrode the coating on the part where the circuit board needs to be describ...

Claims

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Application Information

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IPC IPC(8): H05K3/20
CPCH05K3/20H05K2203/107
Inventor 甑凯军曹昕
Owner 北京启创驿讯科技有限公司
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