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Ball grid array chip clamping holder for circuit board and development board

A circuit board and ball grid technology, applied in the field of ball grid matrix chip holders and development boards, can solve the problems of easily damaged components and soldering tin affecting the secondary welding effect, etc., to achieve convenient operation, meet chip installation requirements, and reduce difficulty Effect

Inactive Publication Date: 2017-05-31
ZHUHAI GREE REFRIGERATION TECH CENT OF ENERGY SAVING & ENVIRONMENTAL PROTECTION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process of reheating to melt the solder is easy to damage the formed PCB board and the components around the chip. At the same time, the residual solder will also affect the effect of the secondary soldering

Method used

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  • Ball grid array chip clamping holder for circuit board and development board
  • Ball grid array chip clamping holder for circuit board and development board
  • Ball grid array chip clamping holder for circuit board and development board

Examples

Experimental program
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Embodiment Construction

[0032] In order to further explain the technical means and functions adopted by the present invention to achieve the predetermined purpose, the specific implementation, structure, features and functions of the application according to the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner.

[0033] Usually, the ball grid matrix chip 6 has a large number of pin solder balls 4 and the distance between the pin solder balls 4 is very small, and the ball grid matrix chip 6 is soldered and installed on the circuit board 3, especially the printed circuit board 3 (PCB board), it is usually necessary to use a multi-layer structure PCB board to meet the wiring requirements, and the soldering success rate between the solder balls 4 of each pin and the PCB board is diffic...

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Abstract

The invention relates to a ball grid array chip clamping holder for a circuit board, which comprises a body and a plurality of conductive components arranged on the body, and is characterized in that each conductive component comprises a first end and a second end used for being connected with a circuit board in a matched manner, and a plurality of the first ends are used for being connected with a plurality of solder balls on a ball grid array chip in a one-to-one correspondence manner; an average value of the distances between the adjacent second ends is greater than an average value of the distances between the adjacent first ends; and / or the arrangement mode of the plurality of the second ends is different from the arrangement mode of the plurality of first ends which belong to the same conductive component with the plurality of second ends. The ball grid array chip clamping holder can solve a problem of difficult welding and wiring brought about by excessively intensive arrangement of the solder balls on the ball grid array chip, the structure of the circuit board is simplified, the installation process of the ball grid array chip is enabled to be simper, easier and more efficient, and the ball grid array chip can be assembled and disassembled conveniently.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a ball grid matrix chip holder and a development board for a circuit board. Background technique [0002] With the rapid development of electronic technology, the feature size of integrated circuit chips has gradually decreased and the complexity has increased, making a large number of electronic products gradually develop in the direction of multi-function, high performance, miniaturization, and light weight. In order to adapt to this development trend, high-density packaging technologies, such as ball grid matrix (BGA) packaging, are gradually being more and more widely used. [0003] Highly integrated ball grid matrix chips usually use matrix-arranged pins with a large number of pins and a small pin pitch, which leads to the need for a 6-layer board when soldering the ball grid matrix chip on a printed circuit board (PCB). Or more than 8 layers of boards can meet the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R33/76H01R12/58
CPCH01R33/765H01R12/58H01R33/7664
Inventor 黄男康燕胡余生曲菲胡飞鹏何春茂王虎颜鲁齐王长恺
Owner ZHUHAI GREE REFRIGERATION TECH CENT OF ENERGY SAVING & ENVIRONMENTAL PROTECTION
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