Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Flow casting process based method for preparing substrate of circulator

A casting process and circulator technology, which is applied in the substrate preparation of YIG ferrite materials and in the field of electronic materials, can solve the problems of high microwave magnetic loss, low density, and high porosity of thick films, and achieve narrow ferromagnetic resonance line width, Excellent temperature stability and low dielectric loss

Inactive Publication Date: 2017-05-31
UNIV OF ELECTRONIC SCI & TECH OF CHINA
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thick film prepared by casting process usually has high porosity, relatively low density and high microwave magnetic loss.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flow casting process based method for preparing substrate of circulator
  • Flow casting process based method for preparing substrate of circulator
  • Flow casting process based method for preparing substrate of circulator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1) Main ingredient formula: Y 3-x Ca x sn x Fe 5-x o 12 , x=0.06;

[0027] 2) Primary ball milling: Using a planetary ball mill, using zirconium balls, milling for 4 to 8 hours under the condition of 241r / min;

[0028] 3. Pre-burning: Pre-burning at 1000°C~1200°C, keep warm for 1~3 hours;

[0029] 4. Doping: Add the following additives: 0.2wt% Bi 2 o 3 , 0.10wt% BaTiO 3 ;

[0030] 5. Secondary ball milling: use a planetary ball mill, add 40~50wt% organic binder and 40~50wt% absolute ethanol to the powder on the original basis, use zirconium balls, under the condition of 241r / min, ball mill 4~8 hours;

[0031] 6. Tape casting: the slurry obtained in the above steps is cast to obtain a raw film tape with a thickness of 100-120 μm;

[0032] 7. Lamination: According to the thickness requirement, the raw film belt lamination is 8~15 layers, and it is pressed and formed under 6MPa;

[0033] 8. Sintering: heat preservation at 1400°C for 4 hours in air atmosphere. ...

Embodiment 2

[0036] 1) Main ingredient formula: Y 3-x Ca x sn x Fe 5-x o 12 , x=0.09;

[0037] 2) Primary ball milling: Using a planetary ball mill, using zirconium balls, milling for 4 to 8 hours under the condition of 241r / min;

[0038] 3. Pre-burning: Pre-burning at 1000°C~1200°C, keep warm for 1~3 hours;

[0039] 4. Doping: Add the following additives: 0.2wt% Bi 2 o 3 , 0.10wt% BaTiO 3 ;

[0040] 5. Secondary ball milling: use a planetary ball mill, add 40~50wt% organic binder and 40~50wt% absolute ethanol to the powder on the original basis, use zirconium balls, under the condition of 241r / min, ball mill 4~8 hours;

[0041] 6. Tape casting: the slurry obtained in the above steps is cast to obtain a raw film tape with a thickness of 100-120 μm;

[0042] 7. Lamination: According to the thickness requirement, the raw film belt lamination is 8~15 layers, and it is pressed and formed under 6MPa;

[0043] 8. Sintering: heat preservation at 1400°C for 4 hours in air atmosphere. ...

Embodiment 3

[0045] 1. Main ingredient formula: Y 3-x Ca x sn x Fe 5-x o 12 , x=0.06;

[0046] 2. One-time ball milling: use a planetary ball mill, use zirconium balls, and mill for 4 to 8 hours under the condition of 241r / min;

[0047] 3. Pre-burning: pre-burning at 1000°C~1200°C, keep warm for 1~3 hours;

[0048] 4. Doping: Add the following additives: 0.2wt% Bi 2 o 3 , 0.10wt% BaTiO 3 ;

[0049] 5. Secondary ball milling: use a planetary ball mill, add 40~50wt% organic binder and 40~50wt% absolute ethanol to the powder on the original basis, use zirconium balls, under the condition of 241r / min, ball mill 4~8 hours;

[0050] 6. Tape casting: the slurry obtained in the above steps is cast to obtain a raw film tape with a thickness of 100-120 μm;

[0051] 7. Lamination: According to the thickness requirement, the raw film belt lamination is 8~15 layers, and it is pressed and formed under 6MPa;

[0052]8. Sintering: heat preservation at 1420°C for 4 hours in air atmosphere.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a flow casting process based method for preparing a substrate of a circulator and belongs to the technical field of electronic materials. The method comprises the following steps: 1. preparing a main material formula: adopting Y(3-x)CaxSnxFe(5-x)O12, wherein x is equal to 0.06; 2. carrying out primary ball-milling; 3. carrying out preburning: carrying out preburning at the temperature of 1,000 DEG C to 1,200 DEG C, and carrying out heat preservation for 1 to 3 hours; 4. carrying out doping: adding the following additives: 0.2wt% of Bi2O3 and 0.10wt% of BaTiO3; 5. carrying out secondary ball-milling: adding 40wt% to 50wt% of organic bonder and 40wt% to 50wt% of anhydrous ethanol into a powder material, and carrying out ball-milling for 4 to 8 hours; 6. carrying out flow casting forming: carrying out flow casting on slurry so as to obtain raw film straps with the thickness of 100 to 120 microns; 7. carrying out lamination: laminating 8 to 15 layers of the raw film straps according to thickness demand, and carrying out press forming under the pressure of 6MPa; and 8. carrying out sintering: carrying out heat preservation for 4 hours at the temperature of 1,360 DEG C to 1,440 DEG C in an air atmosphere. Ferrite dielectric substrates, which are of different thicknesses and are smooth and even, for circulators can be obtained by adopting the method disclosed by the invention; and the substrates have the characteristic of being applicable to an X waveband and have the advantages of good temperature stability, low line width, low dielectric loss, and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, in particular to the technical field of substrate preparation of YIG ferrite material with narrow line width and suitable for X-band circulators. Background technique [0002] Ferrite microstrip circulators are an important component in contemporary communication systems. They play a very important role in the microwave market and the rapidly growing wireless communication market. They are widely used in aerospace, communication, medical and other fields. An indispensable key device in a mobile communication device. The X-band (8~12GHz) microstrip ferrite circulator plays an important role in the radar system. It can form the integrated front end of the X-band Doppler radar together with the microstrip dielectric cavity frequency stabilized oscillator and the microstrip mixer. It has the advantages of small size and light weight, and is more suitable for portable equipment and aircr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C04B35/26C04B35/622H01P11/00H01P1/38
CPCC04B35/2641C04B35/622C04B2235/3208C04B2235/3225C04B2235/3293H01P1/38H01P11/00
Inventor 张曦
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com