Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photo-thermal integration type LED lighting lamp and manufacturing method thereof

A technology of LED lighting and lamps, which is applied in the direction of lighting and heating equipment, lighting devices, components of lighting devices, etc. It can solve the problems of large light-emitting area, unfavorable light distribution of lamps, low thermal conductivity of thermal conductive silicone grease, and attenuation of LED light sources. Achieve good thermoelectric separation effect, high production efficiency and high luminous flux

Pending Publication Date: 2017-05-17
RENMIN UNIVERSITY OF CHINA
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

LED has the characteristics of low power consumption, green energy saving, etc., so it can be widely used in various high-power lamps, such as high-power venue spotlights, lighthouse high-altitude spotlights, etc.; when the lamps need to be more powerful, conventional LED lamps Multiple LED modules need to be designed to form high-power lamps, so many LED modules need to be mounted on the radiator through thermal grease; thermal grease has low thermal conductivity and large thermal resistance, which can easily lead to LED light source attenuation and damage
However, when these components are designed and installed, they need to have high matching accuracy, and at the same time occupy a large area, and the large light-emitting area is not conducive to the light distribution of lamps.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photo-thermal integration type LED lighting lamp and manufacturing method thereof
  • Photo-thermal integration type LED lighting lamp and manufacturing method thereof
  • Photo-thermal integration type LED lighting lamp and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Embodiment 1. Photothermal integrated LED high-power lighting fixture and its preparation method

[0054] like Figure 5 As shown, the photothermal integrated LED high-power lighting fixture of the present invention includes a radiator and an LED light source 5; The LED light source 5 specifically includes a fluorescent layer with a thickness of 0.2 mm, a flip chip, and a light source substrate 3 with a thickness of 1.0 mm arranged sequentially from top to bottom; one side of the light source substrate 3 is arranged with lines and a crystal bonding area, and the other side The honeycomb solderable layer is arranged; the flip-chip is arranged on the die-bonding area, and the dam glue 4 is surrounded on the flip-chip along the edge of the die-bonding area; the LED light source 5 is arranged on the even Warm plate 1.

[0055] Wherein, the light source substrate is selected from an aluminum nitride substrate;

[0056] The flip-chip is a flip-chip LED chip;

[0057] The ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a photo-thermal integration type LED lighting lamp and a manufacturing method of the photo-thermal integration type LED lighting lamp. The photo-thermal integration type LED lighting lamp comprises a cooling device and an LED light source. The cooling device comprises a vapor chamber and cooling fins. The vapor chamber is arranged on the cooling fins. The LED light source is arranged on the vapor chamber. The manufacturing method of the photo-thermal integration type LED lighting lamp comprises the following steps that firstly, a circuit and a die bond area are arranged on one face of a light source substrate, and a weldable layer is arranged on the other face of the light source substrate; secondly, a flip chip is fixed to the die bond area, eutectic soldering is conducted, and then a blue light source; thirdly, dam adhesive is applied to the die bond area around the blue light source, and drying and cooling are conducted; fourthly, the flip chip which is treated in the third step is coated with a fluorescent layer, and then the fluorescent layer is baked and fixed; and fifthly, the LED light source obtained through in the fourth step is welded to the vapor chamber through the weldable layer. The photo-thermal integration type LED lighting lamp has large power; and the manufacturing method of the photo-thermal integration type LED lighting lamp simplifies connection between an LED module and the cooling device and reduces heat resistance.

Description

technical field [0001] The invention relates to a photothermal integrated LED lighting fixture and a preparation method thereof, belonging to the field of LEDs. Background technique [0002] LED (Light Emitting Diode), light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electricity into light. LED has the characteristics of low power consumption, green energy saving, etc., so it can be widely used in various high-power lamps, such as high-power venue spotlights, lighthouse high-altitude spotlights, etc.; when the lamps need to be more powerful, conventional LED lamps Multiple LED modules need to be designed to form high-power lamps, so many LED modules need to be mounted on the radiator through thermal grease; thermal grease has low thermal conductivity and large thermal resistance, which can easily lead to LED light source attenuation and damage. However, when these components are d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21V29/77F21V19/00F21V17/10F21K9/90F21Y115/10
CPCF21K9/90F21V17/101F21V19/001F21V29/773
Inventor 曹永革申小飞麻朝阳
Owner RENMIN UNIVERSITY OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products