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Matte photosensitive resin for photocuring quick molding and preparation method thereof

A matte photosensitive and photocuring technology, applied in the field of 3D printing, can solve the problem of no matte photosensitive resin, and achieve the effect of large-scale popularized production, easy operation, low process conditions and production equipment requirements.

Inactive Publication Date: 2017-05-10
HENAN INST OF ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there has been no report on matt photosensitive resins used in light-curing rapid prototyping so far.

Method used

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  • Matte photosensitive resin for photocuring quick molding and preparation method thereof
  • Matte photosensitive resin for photocuring quick molding and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The matte photosensitive resin for photocuring rapid prototyping of the present embodiment is made of the following raw materials: 45 parts of polyurethane acrylate, epoxy resin (3,4-epoxy-6-methylcyclohexylcarboxylic acid- 3',4'-epoxy-6'-methylcyclohexyl methyl ester) 30 parts, reactive diluent (tripropylene glycol diglycidyl ether diacrylate) 15 parts, cationic photopolymerization initiator (diaryl iodonium hexafluorophosphate) 2 parts, free radical photopolymerization initiator (benzoin dimethyl ether) 1 part, micron silicon dioxide 3 parts, polyethylene wax powder 3 parts, nonionic surfactant (fatty alcohol polyoxygen Vinyl ether) 1 part.

[0043] The preparation method of the light-curing rapid prototyping matte photosensitive resin of the present embodiment is as follows:

[0044] According to the weight ratio, first stir the micron silica, polyethylene wax powder and nonionic surfactant, and then add the remaining polyurethane acrylate, epoxy resin, active dilue...

Embodiment 2

[0046] The matte photosensitive resin for photocuring rapid prototyping of the present embodiment is made of the following raw materials: 5 parts of polyurethane acrylate, 45 parts of epoxy resin (aliphatic glycidyl ether epoxy resin), reactive diluent ( Ethylene glycol diglycidyl ether diacrylate) 20 parts, cationic photopolymerization initiator (triarylsulfonium hexafluorophosphate) 1.0 parts, radical photopolymerization initiator (chlorinated benzophenone) 8 parts , 10 parts of micron silicon dioxide, 1 part of polyethylene wax powder, 2 parts of nonionic surfactant (polyoxyethylene sorbitan monostearate).

[0047] The preparation method of the light-curing rapid prototyping matte photosensitive resin of the present embodiment is as follows:

[0048] According to the weight ratio, first stir the micron silica, polyethylene wax powder and nonionic surfactant, and then add the remaining polyurethane acrylate, epoxy resin, active diluent, cationic photopolymerization initiator...

Embodiment 3

[0050] The matte photosensitive resin for photocuring rapid prototyping of the present embodiment is made of the following raw materials: 40 parts of polyurethane acrylate, 20 parts of epoxy resin (aliphatic glycidyl ether epoxy resin), reactive diluent ( Ethylene glycol diglycidyl ether diacrylate and tripropylene glycol diglycidyl ether diacrylate) 18 parts, cationic photopolymerization initiator (diaryliodonium hexafluorophosphate) 1 part, radical photopolymerization initiator 8 parts of agent (1-hydroxycyclohexyl benzophenone), 6 parts of micron silicon dioxide, 1 part of polyethylene wax powder, non-ionic surfactant (fatty acid methyl ester ethoxylate and polyoxyethylene sorbitan monohard Fatty acid ester) 2 parts.

[0051] The preparation method of the light-curing rapid prototyping matte photosensitive resin of the present embodiment is as follows:

[0052] According to the weight ratio, first stir the micron silica, polyethylene wax powder and nonionic surfactant, and...

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Abstract

The invention discloses matte photosensitive resin for photocuring quick molding and a preparation method thereof. The resin is prepared from the following raw materials in parts by weight: 5-45 parts of urethane acrylate, 5-45 parts of epoxy resin, 10-25 parts of reactive diluent, 1-8 parts of cationic photoinitiator, 1-8 parts of free radical photoinitiator, 1-10 parts of micron silicon dioxide, 1-10 parts of polyethylene wax powder and 1-3 parts of nonionic surfactant. The photosensitive resin has an excellent matte effect due to the addition of micron silicon dioxide and polyethylene wax powder after photocuring quick molding, and clear printing textures on the surface of a molded part manufactured by photocuring quick molding cannot be observed due to the introduction of the matte effect, so that the surface quality of the molded part can be remarkably improved. Therefore, the manufactured three-dimensional solid has better mechanical performance, the shrinkage and warpage situation of the molded part can be reduced, the printing accuracy can be improved, and the practicality is stronger.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to a matte photosensitive resin for photocuring rapid prototyping and a preparation method thereof. Background technique [0002] 3D printing technology, also known as rapid prototyping technology, is based on digital model files, using powdered metal or plastic and other bondable materials to construct objects by layer-by-layer printing. 3D printing technology is becoming more and more competitive in today's manufacturing industry, so it is called "manufacturing technology with industrial revolution significance". 3D printing technologies include fused deposition modeling, selective laser sintering, photo-curing rapid prototyping (stereolithography solidification rapid prototyping) and other technologies. Among them, light-curing rapid prototyping is to scan light (ultraviolet light, laser, etc.) on the resin liquid surface point by point according to the shape of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004B33Y70/00
CPCG03F7/004B33Y70/00
Inventor 于翔王延伟徐茜田银彩张浩
Owner HENAN INST OF ENG
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