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Resin compositionc and application thereof

A technology of resin composition and mixture, which is applied in the field of copper clad laminates, can solve the problems of cracks and non-flame retardant function of the insulating layer, and achieve the effects of high filling amount, excellent flexibility and excellent insulation

Active Publication Date: 2017-05-10
SHAANXI SHENGYI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Chinese patent with application number 201511016722.7 (application date: 2015.12.29, publication number: CN105623198, publication date: 2016.6.1) prepared by adding thermally conductive fillers to bismaleimide modified epoxy and flexible epoxy resin systems As a heat-conducting metal substrate, although the heat dissipation and heat resistance of the board are excellent, and the flexibility has been improved, the peel strength of the board is only 1.4N / mm at the highest, and cracks will still occur after bending, and the insulating layer has no flame-retardant function

Method used

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  • Resin compositionc and application thereof
  • Resin compositionc and application thereof
  • Resin compositionc and application thereof

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Embodiment 1～5 and comparative example 1～3

[0048] Each component used in the epoxy resin composition of embodiment 1~5 and comparative example 1~3 and content (by weight) are as shown in table 1; Each component code and its corresponding component name are as follows Shown:

[0049] (A) bismaleimide modified epoxy resin:

[0050] (A1) Bisphenol A epoxy resin, diallyl bisphenol A, 4,4' diphenylmethane bismaleimide, phosphorus compound prepolymer;

[0051](A2) Bisphenol F epoxy resin, diallyl bisphenol S, 4,4' diphenylmethane bismaleimide, phosphorus compound prepolymer;

[0052] (A3) Bisphenol A novolak epoxy resin, diallyl bisphenol A, 4,4' diphenyl ether bismaleimide, phosphorus compound prepolymer.

[0053] (B) Flexible modified epoxy resin:

[0054] (B1) Silicone modified epoxy resin

[0055] (B2) Dimer acid modified flexible epoxy resin

[0056] (C) polyvinyl butyral;

[0057] (C1) Number average molecular weight 15000

[0058] (C2) Number average molecular weight 25000

[0059] (C3) Number average molecula...

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Abstract

The invention discloses a resin compositionc which comprises the following components in parts by weight: 10-40 parts of bismaleimide modified epoxy, 20-50 parts of flexible epoxy resin, 5-20 parts of polyvinyl butyral, 5-20 parts of phenoxy resin, 380-520 parts of heat-conductive padding, 5-12 parts of curing agent, 2-5 parts of coupling reagent, 0.05-0.85 part of curing accelerator and 2-6 parts of additives. According to the resin compositionc disclosed by the invention, the bismaleimide modified epoxy is introduced, so that the resin compositionc has excellent heat resistance and voltage resistance, and meanwhile, the flexible epoxy resin, the phenoxy resin, the polyvinyl butyral and the heat-conductive padding are added, so that the novel resin compositionc has excellent flexibility, heat dissipation, insulation, adhesion and heat resistance. A metal copper-clad plate prepared from the resin compositionc disclosed by the invention has the characteristics of high heat conductivity coefficient, high breakdown voltage, high peel strength, high heat resistance, halogen-free flame retardant and excellent flexibility.

Description

technical field [0001] The invention belongs to the field of copper-clad laminates, and in particular relates to a resin composition, and also relates to the application of the resin composition. Background technique [0002] With the continuous development of the LED lighting industry, people have higher and higher requirements for LED viewing. LED lighting with a 3D three-dimensional structure has attracted widespread attention. 3D LED lighting has the characteristics of excellent viewing, uniform illumination, and fast heat dissipation. [0003] 3D LED lighting requires metal-based copper-clad laminates to have excellent heat dissipation, insulation, heat resistance, and adhesive properties on the one hand, and also requires PCB substrates to have good flexibility and plasticity to meet processing needs. In order to improve the heat dissipation of the metal substrate as much as possible, it is often necessary to add a large amount of thermally conductive fillers, but with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L29/14C08K13/02C08K3/22C08K3/28C08K5/5435C09K5/14B32B15/01B32B15/20B32B37/06B32B37/10B32B38/18
CPCB32B15/017B32B37/06B32B37/10B32B38/1858B32B2255/06B32B2255/26B32B2307/206B32B2307/302B32B2307/306B32B2307/3065B32B2457/08C08L63/00C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/025C08L2205/035C09K5/14C08L29/14C08K13/02C08K2003/2227C08K2003/282C08K2003/222C08K5/5435
Inventor 郑浩武伟李莎王波
Owner SHAANXI SHENGYI TECH
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