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Device and method for continuously producing high-adhesive-force aluminized film

A high-adhesion, aluminum-coated film technology, applied in sputtering plating, ion implantation plating, vacuum evaporation plating, etc., can solve problems such as easy to fall off, poor adhesion of aluminum-coated films, etc., to achieve simple process, The effect of improving productivity

Active Publication Date: 2017-03-22
BEIJING INSTITUTE OF GRAPHIC COMMUNICATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a device and method for continuous production of high-adhesion aluminized film, which solves the problems of poor adhesion and easy falling off of the current aluminized film, and combines the sputtering buffer layer process and the aluminized process on the surface of the flexible substrate Coupled in the same system to achieve continuous operation and greatly improve production efficiency

Method used

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  • Device and method for continuously producing high-adhesive-force aluminized film

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Use PET as the coating substrate, fix it on the substrate unwinding roller 1, and then evacuate to the background air pressure of 5×10 -3 Pa; start the unwinding roller 1 and the winding roller 5 power supply, set the winding speed to be 1000mm / min, pass into the sputtering gas argon in the sputtering chamber 3, and the air pressure is 8.4×10 -1 Pa, with the Al target as the sputtering target, the sputtering voltage is 380V, and the sputtering current is 6.2A to form a metal Al buffer layer; the aluminum film is evaporated by the aluminum wire thermal evaporation system in the coating chamber 4, and the thickness of the aluminum film is 115nm. Focus on the aluminum coating of 6.45N / 15mm.

Embodiment 2

[0036] Use PE as the coating substrate, fix it on the substrate unwinding roller 1, and then evacuate to the background air pressure of 6×10 -3 Pa; start the unwinding roller 1 and the winding roller 5 power supply, set the winding speed to be 2000mm / min, pass into the sputtering gas argon in the sputtering chamber 3, and the air pressure is 7.8×10 -1 Pa, using the Cr target as the sputtering target, the sputtering voltage is 385V, the sputtering current is 6.2A to form a metal Cr buffer layer; the aluminum film is evaporated by the aluminum wire thermal evaporation system in the coating chamber 4, and the thickness of the aluminum film is 86nm. Focus on the aluminized film of 5.33N / 15mm.

Embodiment 3

[0038] Use PET as the coating substrate, fix it on the substrate unwinding roller 1, and then evacuate to the background air pressure of 6×10 -3 Pa; start the power supply of unwinding roller 1 and winding roller 5, set the winding speed to be 300mm / min, pass into the sputtering gas argon and helium in the sputtering chamber 3, and the air pressure is 8.2×10 -1 Pa, using the Fe target as the sputtering target, the sputtering voltage is 380V, the sputtering current is 7.1A to form a metal Fe buffer layer; the aluminum film is deposited by the aluminum target sputtering system in the coating chamber 4, the thickness of the aluminum film is 40nm, and the adhesion is obtained 6.87N / 15mm aluminized film.

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Abstract

The invention discloses a device and method for continuously producing a high-adhesive-force aluminized film, and belongs to the technical field of flexible packaging base material films. The device is composed of an unwinding roller (1), a tension roller (2), a sputtering chamber (3), a film coating chamber (4), a winding roller (5), auxiliary water way, circuit and gas way systems and an auxiliary vacuum system. The method comprises the steps that uniform-speed film coating is carried out on a flexible base material under the drive of the unwinding roller (1) and the winding roller (5), the flexible base material is provided with a buffer layer in a sputtered and deposited mode when passing through the sputtering chamber (3), and the flexible base material with the buffer layer deposited is subjected to aluminum film deposition when passing through the film coating chamber (4). According to the device and the method, continuous operation can be achieved, the buffer layer sputtering process and the aluminizing process are completed in the same system, the flexible base material does not need to be taken out in the operation process, industrial continuous production is promoted, and the production efficiency can be greatly improved.

Description

technical field [0001] The invention belongs to the technical field of flexible packaging substrate films, and in particular relates to a device and method for continuously producing high-adhesion aluminized films. Background technique [0002] In the field of flexible packaging, especially in the field of food packaging, polymer films are increasingly used to replace glass or metal packaging products due to their advantages of low price, light weight, and good light transmission. However, polymer films have poor barrier properties to small molecules such as oxygen and water vapor, which seriously affects their wide application in the packaging field. Evaporating aluminum film on the surface of the polymer film can improve its barrier performance. The dense "aluminum luster" on the surface of the aluminized film has a better barrier effect, which can not only beautify the product packaging, improve product quality, but also reduce packaging costs. Because aluminized film pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/26C23C14/30C23C14/35C23C14/56C23C14/20C23C14/16
CPCC23C14/16C23C14/165C23C14/205C23C14/26C23C14/30C23C14/35C23C14/562
Inventor 张海宝陈强袁燕王正铎桑利军
Owner BEIJING INSTITUTE OF GRAPHIC COMMUNICATION
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