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Preparing method of high-electric-conductivity silver-free copper alloy and new material

A technology of silver-copper alloy and high conductivity, which is applied in the direction of conductive materials, conductive materials, metal/alloy conductors, etc., can solve the problems of inconvenient smelting methods and non-dense copper crystal structure, and achieve small resistance, dense crystal structure, and improved Effect of crystal structure

Inactive Publication Date: 2017-03-15
何国良 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] (3) The copper crystal structure is not dense
[0008] It can be seen that there are many inconveniences in its smelting method

Method used

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  • Preparing method of high-electric-conductivity silver-free copper alloy and new material

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preparation example Construction

[0029] Refer to figure 1 , A method for preparing a high-conductivity silver-free copper alloy, including the following steps;

[0030] Choose electrolytic copper with a copper content of 99.99% as the copper raw material;

[0031] The vacuum melting furnace is filled with argon to -0.6 to -0.3P when the vacuum degree is -1P;

[0032] After the moisture and residual gas in the heating furnace and raw materials are released, the copper is gradually melted;

[0033] In the copper melting state of 1150-1200 degrees, add 0.5-1% of element manganese, add 0.01-0.05% of rare earth elements cerium and lanthanum, and 0.002%-0.005% of lithium element. And other trace rare elements, so that the copper liquid can completely remove impurities and change the copper metallographic crystal structure to become uniform and compact; improve and enhance the conductive function of the copper alloy.

[0034] Under vacuum conditions, solid solution elements are added to improve the conductivity of copper, r...

Embodiment 1

[0040] A new high-conductivity silver-free copper alloy material is composed of the following components by weight: 0.5% manganese, 0.01% cerium, 0.01% lanthanum, 0.002% lithium, and the rest is copper.

Embodiment 2

[0042] A new high-conductivity silver-free copper alloy material consisting of the following components by weight:

[0043] 1% manganese, 0.05% cerium, 0.05% lanthanum, 0.005% lithium, and the rest is copper.

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Abstract

The invention discloses a preparing method of a high-electric-conductivity silver-free copper alloy. The method comprises following steps: S1, copper is smelted in a vacuum smelting furnace, and argon is inflated; S2, under the copper melting state at the temperature of 1150 DEG C to 1200 DEG C, 0.5% to 1% of manganese is added, 0.01% to 0.05% of cerium and lanthanum of the rare earth elements are added, and 0.002% to 0.005% of lithium is added; the method has the beneficial effects that the silver-free copper alloy prepared through the method is low in electric resistance, high in electric conductivity and capable of achieving and being close to the conducting performance of silver; energy is saved, meanwhile, the alloy can become a new function material which is essential in the field of electrical conductor grade copper and the future equipment manufacturing industry ; the alloy can replace silver to be used in part of fields such as aerospace, aviation, navigation, submarines and ship manufacturing, military equipment lightweight and the like, high-end electricians, high-end electronic appliances, energy-economic transformers, motors, wind energy, solar energy, electric locomotives and new energy electric automobiles; or the alloy can be widely applied in the superconducting field and the like.

Description

Technical field [0001] The invention relates to a method for preparing a copper alloy, in particular to a method for preparing a silver-free copper alloy with high conductivity. Background technique [0002] The statements in this section merely provide background information related to the disclosure of the present invention and may not constitute prior art. [0003] Under the existing technology, the conductivity of copper alloy materials is between 98% and 99.89%, which severely limits the application scope of copper for electrical engineering. [0004] Reasons for the low conductivity of copper used in electrical engineering at present: [0005] (1) Smelting under natural conditions makes copper contain high oxygen and other harmful gases; [0006] (2) According to national standards, no more than 0.005% of impurities are allowed to exist in electrolytic copper and copper wire rods; [0007] (3) The copper crystal structure is not dense. [0008] This shows that its smelting method h...

Claims

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Application Information

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IPC IPC(8): C22C9/05C22C1/02H01B1/02
CPCC22C9/05C22C1/02H01B1/026
Inventor 何国良
Owner 何国良
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