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Organosiloxane, curable silicone composition, and semiconductor device

A technology of organosiloxane and composition, which is applied in the field of curable silicone composition, can solve problems such as insufficient adhesion, and achieve the effect of excellent reliability

Active Publication Date: 2017-02-22
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, even these curable silicone compositions suffer from insufficient adhesion to substrates that come into contact during curing

Method used

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  • Organosiloxane, curable silicone composition, and semiconductor device
  • Organosiloxane, curable silicone composition, and semiconductor device
  • Organosiloxane, curable silicone composition, and semiconductor device

Examples

Experimental program
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Effect test

preparation example Construction

[0063] In the above-mentioned production method, it is necessary to react in an amount of at least 1 mol to 2 mol of the above-mentioned compound per 1 mol of the above-mentioned organosiloxane. This is because: when the amount of the above-mentioned compound is more than the lower limit of the above-mentioned range, the obtained organosiloxane can impart sufficient adhesiveness to the curable silicone composition; on the other hand, when the amount of the above-mentioned compound is When it is below the upper limit of the above range, the obtained organosiloxane reacts with the hydrogen atoms bonded to the silicon atoms in the hydrosilylation reaction-curable silicone composition, and the transmittance of the obtained cured product can be improved.

[0064] Examples of the acid used in the above production method include hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polycarboxylic acid, trifluorometh...

Embodiment

[0131] The organosiloxane, curable silicone composition, and semiconductor device of the present invention will be described in detail by way of examples. In addition, in the formula, Me, Vi, Ph, and Ep respectively represent a methyl group, a vinyl group, a phenyl group, and a 3-glycidoxypropyl group.

reference example 1

[0133] Put 400g (2.02mol) of phenyltrimethoxysilane and 93.5g (0.30mol) of 1,3-divinyl-1,3-diphenyldimethyldisiloxane into the reaction vessel, after pre-mixing, 1.74 g (11.6 mmol) of trifluoromethanesulfonic acid was added, and 110 g (6.1 mol) of water was added with stirring, and heated to reflux for 2 hours. Thereafter, heating and atmospheric distillation were performed so that the temperature was 85°C. Next, 89 g of toluene and 1.18 g (21.1 mmol) of potassium hydroxide were charged, heated and distilled at atmospheric pressure until the reaction temperature reached 120° C., and reacted at this temperature for 6 hours. Then, it cooled to room temperature, and 0.68 g (11.4 mmol) of acetic acid was injected|thrown-in and neutralized. After the generated salt was filtered off, low boiling point substances were removed by heating and reducing pressure from the obtained transparent solution, and an average unit formula was prepared:

[0134] (MePhViSiO 1 / 2 ) 0.23 (PhSiO 3 / ...

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Abstract

An organosiloxane represented by a general formula; a curable silicone composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having, per molecule, at least two hydrogen atoms each having a silicon atom bound thereto, (C) an adhesion promoter comprising the above-mentioned organosiloxane and (D) a hydrosilylation reaction catalyst; and a semiconductor device in which a semiconductor element is sealed with a cured product of the above-mentioned composition. Provided are: a novel organosiloxane; a curable silicone composition which contains the organosiloxane as an adhesion promoter and can be formed into a cured article having excellent adhesion to various base materials; and a semiconductor device which is produced using the composition and has excellent reliability.

Description

technical field [0001] The present invention relates to a novel organosiloxane, a curable silicone composition containing the organosiloxane as an adhesion promoter, and a semiconductor device using the composition. Background technique [0002] In general, hydrosilylation reaction-curable silicone compositions have insufficient adhesion to substrates such as metals or organic resins, especially thermoplastic resins. Therefore, for example, curable silicone compositions containing: Alkenyl organopolysiloxanes based on silicon atoms, organohydrogenpolysiloxanes having hydrogen atoms bonded to silicon atoms, adhesion promoters comprising isocyanuric acid derivatives, and catalysts for hydrosilylation reactions, Wherein, the isocyanuric acid derivatives have one or more groups selected from the following group: one or more functional groups selected from epoxy group, glycidoxy group, alkoxysilyl group, cross-linked Linked vinyl and hydrosilyl groups (Si-H groups) (see Patent D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F7/08C08G59/10C08G77/388C08K5/544C08L83/05C08L83/07C08L83/08C09J11/06C09J183/07H01L23/29H01L23/31
CPCC07F7/08C08G59/10C09J11/06C08K5/544C08G77/388C08L83/08H01L23/29H01L23/31H01L2924/181H01L2224/32245H01L2224/48091H01L2224/48257H01L2224/73265C07D405/14C08L83/04C08G77/14C08G77/26C08G77/18C08G77/50C08L83/14C08L83/06H01L2924/00014H01L2924/00012H01L2924/00C08K5/56C08L83/00C08K3/20C08K5/541C08K5/05C07F7/0838H01L23/296C08K5/5477H01L33/56C08L2203/206C08L2205/025
Inventor 饭村智浩户田能乃稻垣佐和子宫本侑典古川晴彦
Owner DOW TORAY CO LTD
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