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A preparation method of boron nitride and aluminum nitride co-doped polyimide composite film with high thermal conductivity and high insulation

A polyimide and composite film technology, which is applied in the field of composite film preparation, can solve the problems of application limitation, poor thermal conductivity, insulation and mechanical properties of the polyimide composite film, and achieves improved comprehensive performance and improved electrical properties. Insulation and mechanical properties, the effect of good overall macroscopic properties

Active Publication Date: 2018-04-24
大同共聚西安科技有限公司
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the thermal conductivity, insulation and mechanical properties of the existing polyimide composite film are poor, and its application in the field of electrical insulation is limited, and to provide a boron nitride and aluminum nitride composite film Preparation method of doped polyimide composite film with high thermal conductivity and high insulation

Method used

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  • A preparation method of boron nitride and aluminum nitride co-doped polyimide composite film with high thermal conductivity and high insulation
  • A preparation method of boron nitride and aluminum nitride co-doped polyimide composite film with high thermal conductivity and high insulation
  • A preparation method of boron nitride and aluminum nitride co-doped polyimide composite film with high thermal conductivity and high insulation

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specific Embodiment approach 1

[0038] Embodiment 1: This embodiment is a method for preparing a polyimide composite film with high thermal conductivity and high insulation co-doped with boron nitride and aluminum nitride, which is characterized in that the method is completed according to the following steps:

[0039] 1. Preparation of ultra-thin boron nitride powder:

[0040] ①. Add boron nitride powder and oxides to concentrated acid, then stir and react in an ice-water bath at a stirring speed of 100r / min to 300r / min for 60min to 120min to obtain mixture A; heat mixture A to 50°C, Stir the reaction at a temperature of 50°C and a stirring speed of 100r / min to 300r / min for 60min to 180min, then cool to room temperature, and then add 30% hydrogen peroxide dropwise into mixture A at a rate of 1mL / min. solution to obtain mixture B; in an ice-water bath, add deionized water to mixture B to obtain mixture C; then centrifuge mixture C at a centrifugal speed of 6000r / min to 8000r / min for 5min to 15min, remove the...

specific Embodiment approach 2

[0062] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the organic solvent described in Step 2 ① is N-methylpyrrolidone or N-dimethylformamide. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0063] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the diamine in Step 2② is 4,4′-diaminodiphenyl ether. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention provides a preparation method of a boron nitride and aluminum nitride co-doped high-heat-conduction and high-insulation polyimide composite thin film and relates to a preparation method of a composite thin film, aiming at solving the problems of an existing polyimide composite thin film that the heat conductivity, insulation property and mechanical properties are poor so that the application of the existing polyimide composite thin film in the field of electric insulation is limited. The preparation method comprises: 1, preparing ultrathin boron nitride powder; 2, preparing a viscous polyamic acid solution containing ultrathin-layer boron nitride and aluminum nitride; 3, preparing a composite thin film to obtain the boron nitride and aluminum nitride co-doped high-heat-conduction and high-insulation polyimide composite thin film. According to the boron nitride and aluminum nitride co-doped high-heat-conduction and high-insulation polyimide composite thin film prepared by the preparation method provided by the invention, the coefficient of heat conductivity is improved by 68 percent to 330 percent, the insulating resistance is improved by 0.8 to 4.1 times and the tensile strength is improved by 1 percent to 31 percent. The preparation method provided by the invention is suitable for preparing the boron nitride and aluminum nitride co-doped high-heat-conduction and high-insulation polyimide composite thin film.

Description

technical field [0001] The invention relates to a preparation method of a composite film. Background technique [0002] High-performance polyimide film is an indispensable key supporting material for high-performance variable-frequency motors such as wind turbines, high-speed traction motors, rolling motors, electric vehicle motors, and military products. It is a high-performance electrical insulation material and is mainly used for Turn-to-turn insulation and ground insulation of variable frequency motor windings. The development of this product originated from the needs of frequency conversion technology and variable frequency speed regulation motors. In 1994, DuPont of the United States, ABB of Switzerland and Siemens of Germany jointly developed the corona-resistant polyimide film (Kapton FCR), which made the corona-resistant life of the material reach hundreds or even hundreds of ordinary polyimide films. Thousands of times. In addition, the corona-resistant polyimide...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K3/38C08K3/28C08J5/18
CPCC08J5/18C08J2379/08C08K3/28C08K3/38C08K2003/282C08K2003/385C08K2201/003C08K2201/011C08L2203/16C09K5/14C08L79/08
Inventor 刘晓旭闫凯池红岩
Owner 大同共聚西安科技有限公司
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