Modified phenolic resin heat insulation material used for external wall

Abstract

The invention discloses a modified phenolic resin heat insulation material used for an external wall. The material includes, by weight, 30-60 parts of foam-type phenolic resin, 1-5 parts of polyurethane, 1-5 parts of a foam stabilizer, 1-5 parts of a foamer, 1-2 parts of azodicarbonamide, 1-2 parts of a surfactant, 5-12 parts of modified bagasse, 5-10 parts of organic silicon-modified phenolic resin, 5-10 parts of foamed polystyrene, 0.5-1.2 parts of a curing agent T-31, 0.1-0.8 parts of an epoxy accelerator, 1-2 parts of methylvinyldichlorosilane, 2-6 parts of p-toluensulfonyl chloride, 2-12 parts of wollastonite, 3-12 parts of calcined pottery clay, 5-15 parts of turf, and 50-80 parts of water. The material has good toughness, high strength, good mechanical, very high thermal stability and excellent heat insulation performance.

Description

technical field [0001] The invention relates to the technical field of thermal insulation materials, in particular to a modified phenolic resin thermal insulation material for exterior walls. Background technique [0002] Among the external wall insulation materials such as polystyrene foam, glass wool, mineral wool and polyurethane that appear on the market, only phenolic resin has the properties of flame retardant, low toxicity and low smoke. The effect is also 2-3 times higher than that of ordinary roofing materials. After installing phenolic foam insulation boards on the outer walls, the heat insulation performance of the house is greatly enhanced, and it can save energy by more than 60% compared with buildings without insulation layers. However, phenolic foam insulation materials have the defects of high brittleness, poor mechanical properties and thermal stability, and have become a bottleneck restricting the large-scale popularization and application of phenolic foam ...

AI Technical Summary

Problems solved by technology

However, phenolic foam insulation materials have the defects of high brittleness, poor mechanical properties and thermal stability, and have become a bottleneck restricting the large-scale application of phenolic foam insulation boards.