Preparation process of thermal double-sided adhesive tape

Abstract

The invention discloses a preparation process of a thermal double-sided adhesive tape. A thermal double-sided film is attached between a radiating part and a heating part and includes a light release PET (polyethylene terephthalate) film and a heavy release PET film, a first thermal adhesive layer, a graphite layer and a second thermal adhesive layer are arranged sequentially between the light release PET layer and the heavy release PET layer, and the graphite layer provides a graphite modifier layer for each of the upper and lower surfaces of polyimide film to obtain treated polyimide film, the graphite modifier has a viscosity of 30000-48000 CP, and the graphite modifier is made from, by weight, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, diaminodiphenylmethane, dimethylformamide, ethylene glycol, and polydimethylsiloxane. The adhesive tape is avoided being partially superheated, thermal transfer uniformity of the adhesive tape is achieved, and radiating property stability for the adhesive tape is improved.

Description

technical field [0001] The invention relates to a preparation process of a heat-conducting double-sided adhesive tape, which belongs to the technical field of double-sided adhesive sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, l...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness