Heat transfer double-sided adhesive tape

Abstract

The invention discloses a heat transfer double-sided adhesive tape, namely a radiating double-sided adhesive film, which is attached between a radiating part and a heating component and comprises a light peelable PET (polyethylene terephthalate) film and a heavy peelable PET film; and a first heat transfer glue adhesive layer, a graphite layer and a second heat transfer adhesive layer are arranged sequentially between the light peelable PET film and the heavy peelable PET film; the graphite layer is made by a process including the steps of heating a polyimide film from room temperature to 250 DEG C, holding the temperature, heating to 400 DEG C, and cooling to room temperature; applying a layer of graphite modifier to each of the upper and lower surfaces of the polyimide film to obtain the processed polyimide film, wherein the graphite modifier is 30000-48000 CP in viscosity. Pinholes are filled during heating, crystallinity is improved, and non-uniformity due to excessive heat shrinkage is also overcome.

Description

technical field [0001] The invention relates to a heat-conducting double-sided adhesive tape, which belongs to the technical field of double-sided adhesive sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to qu...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

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