Low-dielectric POSS type epoxy resin composite and preparation method thereof
A technology of epoxy resin and composite materials, which is applied in the field of polymer materials, can solve the problems of low polarizability, complex synthesis process, and low dielectric constant, so as to reduce the dielectric constant and dielectric loss, and improve the preparation process. Simple, good heat resistance effect
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Embodiment 1
[0022] (1) Mix 30g POSS type epoxy resin monomer EP0409, 10g curing agent D230, without accelerator, mix and stir evenly at 60°C, put it in a vacuum oven to remove air bubbles; (2) add 1.5g OVS additive Added to the solution in step (1), ultrasonically stirred and mixed evenly, vacuumed, and N 2 , heated up to 70°C, and stirred for 1.5 hours for prepolymerization; (3) Pour the prepolymer obtained in step (2) into a polytetrafluoroethylene mold preheated at 70°C, and solidify in 4 stages, the first stage 70 Keep at ℃ for 4 hours, keep at 120℃ for 2h in the second stage, keep at 160℃ for 2h in the third stage, and keep at 200℃ for 2h in the fourth stage, and cure to obtain a low-dielectric epoxy resin composite material, and its properties are shown in Table 1;
Embodiment 2
[0024] (1) Mix 30g POSS type epoxy resin monomer EP0408, 12g curing agent TFDB, without accelerator, mix and stir evenly at 60°C, put in a vacuum oven to remove air bubbles; (2) add 1.5g OAPS additive Added to the solution in step (1), ultrasonically stirred and mixed evenly, vacuumed, and N 2 , heated up to 70°C, and stirred for 1.5 hours for prepolymerization; (3) Pour the prepolymer obtained in step (2) into a polytetrafluoroethylene mold preheated at 70°C, and solidify in 4 stages, the first stage 70 Keep at ℃ for 4 hours, keep at 120℃ for 2h in the second stage, keep at 160℃ for 2h in the third stage, and keep at 200℃ for 2h in the fourth stage, and cure to obtain a low-dielectric epoxy resin composite material, and its properties are shown in Table 1;
Embodiment 3
[0026] (1) Mix and stir 30g POSS type epoxy resin monomer EP0435, 1.2g curing agent DICY, and 0.3g accelerator 2-methylimidazole at 60°C, and put them into a vacuum oven to evacuate and remove air bubbles; (2 ) 1.5g OPS additive is added in the solution in the step (1), ultrasonic stirring is mixed evenly, vacuumizes, feeds N 2 , heated up to 70°C, and stirred for 1.5 hours for prepolymerization; (3) Pour the prepolymer obtained in step (2) into a polytetrafluoroethylene mold preheated at 70°C, and solidify in 4 stages, the first stage 70 Keep at ℃ for 4 hours, keep at 120℃ for 2h in the second stage, keep at 160℃ for 2h in the third stage, and keep at 200℃ for 2h in the fourth stage, and cure to obtain a low-dielectric epoxy resin composite material, and its properties are shown in Table 1;
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