Connecting method for tungsten alloy and molybdenum alloy

A connection method, molybdenum alloy technology, applied in welding medium, welding equipment, welding equipment and other directions, to achieve the effect of promoting mutual diffusion, promoting promotion, and shortening the connection process cycle

Inactive Publication Date: 2016-12-07
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the low-temperature high-strength welding connection of refractory metal tungst

Method used

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  • Connecting method for tungsten alloy and molybdenum alloy
  • Connecting method for tungsten alloy and molybdenum alloy
  • Connecting method for tungsten alloy and molybdenum alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] figure 1 It is the process flow diagram of the ultra-thin copper thin film intermediate layer of the present invention. The tungsten alloy to be welded is a 93W4Ni3Fe tungsten alloy with a size of Φ25mm×8mm, and the molybdenum alloy to be welded is a Mo1 molybdenum alloy with a size of Φ25mm×8mm. The ultra-thin copper film is deposited by magnetron sputtering, and the film thickness is 0.4μm. is 600°C. Diffusion welding process conditions are: welding temperature 700 ℃, welding pressure 20MPa, holding time 900s.

[0029] The specific steps are as follows:

[0030] 1. Machining and surface cleaning of raw materials tungsten alloy and molybdenum alloy:

[0031] Use an ultra-precision surface grinder to process tungsten alloy and molybdenum alloy into round sheets. Before welding, use 600#, 1000#, 1500#, 2000# SiC sandpaper to polish the surface to be welded of the round sheet, and then use a high-precision polishing machine to polish the polished surface. For polishin...

Embodiment 2

[0045] The tungsten alloy to be welded is a 93W4Ni3Fe tungsten alloy with a size of Φ25mm×8mm, and the molybdenum alloy to be welded is a Mo1 molybdenum alloy with a size of Φ25mm×8mm. The ultra-thin copper film is deposited by magnetron sputtering, and the film thickness is 0.8μm. is 600°C. Diffusion welding process conditions are: welding temperature 700 ℃, welding pressure 20MPa, holding time 900s.

[0046] The specific steps are as follows:

[0047] 1. Machining and surface cleaning of raw materials tungsten alloy and molybdenum alloy:

[0048] Use an ultra-precision surface grinder to process tungsten alloy and molybdenum alloy into round sheets. Before welding, use 600#, 1000#, 1500#, 2000# SiC sandpaper to polish the surface to be welded of the round sheet, and then use a high-precision polishing machine to polish the polished surface. For polishing, put the polished tungsten alloy and molybdenum alloy into an organic solvent, and use an ultrasonic cleaning machine to...

Embodiment 3

[0056] The tungsten alloy to be welded is a 93W4Ni3Fe tungsten alloy with a size of Φ25mm×8mm, and the molybdenum alloy to be welded is a Mo1 molybdenum alloy with a size of Φ25mm×8mm. The ultra-thin copper film is deposited by magnetron sputtering, and the film thickness is 0.4μm. is 600°C. Diffusion welding process conditions are: welding temperature 750°C, welding pressure 20MPa, holding time 900s.

[0057] The specific steps are as follows:

[0058] 1. Machining and surface cleaning of raw materials tungsten alloy and molybdenum alloy:

[0059] Use an ultra-precision surface grinder to process tungsten alloy and molybdenum alloy into round sheets. Before welding, use 600#, 1000#, 1500#, 2000# SiC sandpaper to polish the surface to be welded of the round sheet, and then use a high-precision polishing machine to polish the polished surface. For polishing, put the polished tungsten alloy and molybdenum alloy into an organic solvent, and use an ultrasonic cleaning machine to...

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Abstract

The invention relates to a connecting method for a tungsten alloy and a molybdenum alloy. Specifically, an ultrathin copper film is deposited on each of the surfaces of the tungsten alloy and the molybdenum alloy or an ultrathin copper foil is added on each of the surfaces of the tungsten alloy and the molybdenum alloy, the plasma activated sintering connection technology is utilized, and the low-temperature and high-strength connection of the tungsten alloy and the molybdenum alloy is achieved under the technological conditions that the axial pressure ranges from 5 MPa to 30 MPa, the vacuum degree is smaller than or equal to 0.1 Pa, the activation time ranges from 20 s to 100 s, the temperature rise rate ranges from 80 DEG C/min to 200 DEG C/ min, and the temperature ranging from 650 DEG C to 850 DEG C is kept for 300 s-1,200 s. The connecting method has the beneficial effects that through introduction of ultrathin copper activated intermediate layers, the connecting temperature of the refractory metal tungsten alloy and the refractory metal molybdenum alloy is remarkably lowered, the connecting strength of the refractory metal tungsten alloy and the refractory metal molybdenum alloy is improved, low-temperature, rapid and high-strength connection of the tungsten alloy and the molybdenum alloy is achieved at the extremely low temperature for the first time, the shearing strength reaches 224.8 MPa, and compared with direct connection of the tungsten and the molybdenum, the strength is improved by near 7 times; and the connecting temperature is greatly reduced, and reliable connection of connecting connectors is improved.

Description

technical field [0001] The invention relates to the connection field of refractory metal tungsten and molybdenum, in particular to a connection method for low-temperature high-strength connection of tungsten alloy and molybdenum alloy by adding an ultra-thin copper intermediate layer and using electric field activation connection technology. Background technique [0002] Metal tungsten is the metal with the highest melting point, its melting point is as high as 3422°C, and its density is 19.3g / cm 3 , Tungsten and tungsten alloys have the advantages of high high temperature strength, high elastic modulus, small thermal expansion coefficient, excellent chemical corrosion resistance, and good electron emission performance. Therefore, tungsten and its alloys are widely used in aerospace, nuclear industry, weapon industry, power electronics and many other fields. With the development of industry and the advancement of science and technology, it has been found that molybdenum is ...

Claims

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Application Information

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IPC IPC(8): B23K10/02B23K35/30B23K35/38B23P15/00C23C14/35C23C14/16
CPCB23K10/02B23K35/302B23K35/38B23K2103/08B23P15/00C23C14/165C23C14/35
Inventor 张联盟饶梅罗国强沈强王传彬张建朱翰为
Owner WUHAN UNIV OF TECH
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