Nitrogen trifluoride plasma cleaning device

Abstract

The invention discloses a nitrogen trifluoride plasma cleaning device which comprises a shell, an electrolytic bin and a thermal contact. An opening is formed in the left side of the shell and fixedly connected with the left end of a shell of a cleaning bin. An opening is formed in the left side of the cleaning bin and in threaded connection with a bin cover. Strip-shaped plate electrodes are bonded to the inner side wall of a cavity of the cleaning bin. Round plate electrodes are bonded to the inner wall of the bottom of the cleaning bin and the inner wall of the bin cover correspondingly. The shell of the cleaning bin is sleeved with a spiral coil. A particle accelerator is connected with the right end of the cleaning bin through a made-to-order arc pipeline. The right end of the cleaning bin is connected with a vacuum pump through a conduit. The vacuum pump is fixedly mounted inside the shell, and connected with a tail gas treatment device through an exhaust pipe. The thermal contact is fixedly connected with an internal support of the cleaning bin. The thermal contact and a calibration block are connected with a voltmeter through wires correspondingly. According to the nitrogen trifluoride plasma cleaning device, nitrogen trifluoride serves as an ion supplying source, cleaning is conducted in a plasma corrosion mode, and circuit boards and components are effectively prevented from being damaged.

Description

technical field [0001] The invention relates to the technical field of plasma cleaning, in particular to a nitrogen trifluoride plasma cleaning device. Background technique [0002] With the rapid development of the electronics industry, a large number of circuit boards and other components are used. With the upgrading of equipment, large quantities of electronic waste are recycled, and the problem of cleaning waste circuit boards and components follows. Traditional water washing is difficult to clean the oxide layer on the surface of circuit boards and components, while pickling will cause damage to circuit boards and components due to the difficulty in controlling the degree of corrosion, seriously affecting their secondary use and resulting in waste of resources. Contents of the invention [0003] The object of the present invention is to provide a nitrogen trifluoride plasma cleaning device to solve the problems raised in the above-mentioned background technology. [...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronics industry, a large number of circuit boards and other components are used. With the upgrading of equipment, large quantities of electronic waste are recycled, and the problem of cleaning waste circuit boards and components follows. Traditional water washing is difficult to clean the oxide layer on the surface of circuit boards and components, while pickling will cause damage to circuit boards and components due to the difficulty in controlling the degree of corrosion, seriously affecting their secondary use, resulting in waste of resources

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